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公开(公告)号：US20190094462A1
公开(公告)日：2019-03-28
申请号：US16185654
申请日：2018-11-09
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： Jean-Robert Manouvrier , Jean-Francois Carpentier , Patrick LeMaitre
Abstract: An electro-optic device may include a photonic chip having an optical grating coupler at a surface. The optical grating coupler may include a first semiconductor layer having a first base and first fingers extending outwardly from the first base. The optical grating coupler may include a second semiconductor layer having a second base and second fingers extending outwardly from the second base and being interdigitated with the first fingers to define semiconductor junction areas, with the first and second fingers having a non-uniform width. The electro-optic device may include a circuit coupled to the optical grating coupler and configured to bias the semiconductor junction areas and change one or more optical characteristics of the optical grating coupler.
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公开(公告)号：US09647625B2
公开(公告)日：2017-05-09
申请号：US14084394
申请日：2013-11-19
Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
Inventor： David Petit , Sylvain Joblot , Pierre Bar , Jean-Francois Carpentier , Pierre Dautriche
CPC classification number: H03H3/02 , G01N29/022 , G02F1/133707 , H03H3/04 , H03H9/0028 , H03H9/02102 , H03H9/175 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
Abstract: A method for manufacturing a wafer on which are formed resonators, each resonator including, above a semiconductor substrate, a stack of layers including, in the following order from the substrate surface: a Bragg mirror; a compensation layer made of a material having a temperature coefficient of the acoustic velocity of a sign opposite to that of all the other stack layers; and a piezoelectric resonator, the method including the successive steps of: a) depositing the compensation layer; and b) decreasing thickness inequalities of the compensation layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each resonator.
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公开(公告)号：US10181654B2
公开(公告)日：2019-01-15
申请号：US14869811
申请日：2015-09-29
Applicant: STMICROELECTRONICS SA
Inventor： Jean-Francois Carpentier , Sébastien Pruvost , Patrice Garcia , Pierre Busson , Pierre Dautriche
IPC: H01Q21/00 , H01Q23/00 , H01L23/498 , H01L23/66 , H01L23/00 , H01Q19/00 , H01Q19/10 , H01Q19/185 , H01L23/31 , H01L23/552
Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
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公开(公告)号：US10126499B2
公开(公告)日：2018-11-13
申请号：US14754994
申请日：2015-06-30
Applicant: STMICROELECTRONICS SA , STMICROELECTRONICS (CROLLES 2) SAS
Inventor： Jean-Robert Manouvrier , Jean-Francois Carpentier , Patrick Lemaitre
Abstract: An electro-optic device may include a photonic chip having an optical grating coupler at a surface. The optical grating coupler may include a first semiconductor layer having a first base and first fingers extending outwardly from the first base. The optical grating coupler may include a second semiconductor layer having a second base and second fingers extending outwardly from the second base and being interdigitated with the first fingers to define semiconductor junction areas, with the first and second fingers having a non-uniform width. The electro-optic device may include a circuit coupled to the optical grating coupler and configured to bias the semiconductor junction areas and change one or more optical characteristics of the optical grating coupler.
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公开(公告)号：US20170363507A1
公开(公告)日：2017-12-21
申请号：US15694156
申请日：2017-09-01
Applicant: STMicroelectronics (Crolles 2) SAS , STMICROELECTRONICS SA
Inventor： Jean-Francois Carpentier , Patrick Le Maitre , Jean-Robert Manouvrier , Charles Baudot , Bertrand Borot
CPC classification number: G01M11/02 , G01M11/33 , G01R31/2656 , G01R31/27 , G01R31/2884 , G01R31/303 , G01R31/311 , G01R31/31728 , G01R35/00 , G02B6/00 , G02B6/12004 , G02B6/2808 , G02B6/34
Abstract: A semiconductor device may include a semiconductor wafer, and a reference circuit carried by the semiconductor wafer. The reference circuit may include optical DUTs, a first set of photodetectors coupled to outputs of the optical DUTs, an optical splitter coupled to inputs of the optical DUTs, and a second set of photodetectors coupled to the optical splitter. The optical splitter is to be coupled to an optical source and configured to transmit a reference optical signal to the first set of photodetectors via the optical DUTs and the second set of photodetectors.
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Patent Agency Ranking
公开(公告)号：US20160020524A1
公开(公告)日：2016-01-21
申请号：US14869811
申请日：2015-09-29
Applicant: STMICROELECTRONICS SA
Inventor： Jean-Francois Carpentier , Sébastien Pruvost , Patrice Garcia , Pierre Busson , Pierre Dautriche
IPC: H01Q19/185 , H01L23/00 , H01L23/498 , H01L23/31 , H01Q19/10 , H01Q19/00
CPC classification number: H01Q21/0087 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L24/13 , H01L2223/6677 , H01L2224/1319 , H01L2224/13582 , H01L2224/16225 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01Q19/005 , H01Q19/10 , H01Q19/185 , H01Q21/0025 , H01Q21/0093 , H01Q23/00 , H01L2924/00
Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
Abstract translation: 一种毫米波收发器，包括形成插入件的板，其具有支撑互连网络的上表面，并且其下表面旨在通过凸块组装在印刷电路板上; 组装在所述插入件的上表面上的集成电路芯片; 由形成在插入件的上表面上的轨道制成的天线; 以及在每个天线前面的印刷电路板的上表面上的反射器，考虑到插入材料的介电常数，每个天线和反射板之间的有效距离在波长的四分之一左右 。
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公开(公告)号：US09791346B1
公开(公告)日：2017-10-17
申请号：US15133614
申请日：2016-04-20
Applicant: STMICROELECTRONICS SA , STMICROELECTRONICS (CROLLES 2) SAS
Inventor： Jean-Francois Carpentier , Patrick Lemaitre , Jean-Robert Manouvrier , Charles Baudot , Bertrand Borot
CPC classification number: G01M11/02 , G01R31/2656 , G01R31/27 , G01R31/2884 , G01R31/303 , G01R31/311 , G01R31/31728 , G01R35/00 , G02B6/00 , G02B6/12004 , G02B6/2808 , G02B6/34
Abstract: A semiconductor device may include a semiconductor wafer, and a reference circuit carried by the semiconductor wafer. The reference circuit may include optical DUTs, a first set of photodetectors coupled to outputs of the optical DUTs, an optical splitter coupled to inputs of the optical DUTs, and a second set of photodetectors coupled to the optical splitter. The optical splitter is to be coupled to an optical source and configured to transmit a reference optical signal to the first set of photodetectors via the optical DUTs and the second set of photodetectors.
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公开(公告)号：US09645469B2
公开(公告)日：2017-05-09
申请号：US14836011
申请日：2015-08-26
Applicant: STMICROELECTRONICS (CROLLES 2) SAS , STMICROELECTRONICS SA
Inventor： Patrick Lemaitre , Jean-Francois Carpentier , Charles Baudot , Jean-Robert Manouvrier
CPC classification number: G02F1/225 , G02F1/025 , G02F1/2257 , G02F2001/212 , G02F2203/15
Abstract: An electro-optic (E/O) device includes an asymmetric optical coupler having an input and first and second outputs, a first optical waveguide arm coupled to the first output of the first asymmetric optical coupler, and a second optical waveguide arm coupled to the second output of the first asymmetric optical coupler. At least one E/O amplitude modulator is coupled to at least one of the first and second optical waveguide arms. An optical combiner is coupled to the first and second optical waveguide arms downstream from the at least one E/O amplitude modulator.
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公开(公告)号：US20170288781A1
公开(公告)日：2017-10-05
申请号：US15083616
申请日：2016-03-29
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor： Jean-Francois Carpentier , Patrick Lemaitre , Jean-Robert Manouvrier , Denis Pache , Stephane Le Tual
IPC: H04B10/516 , H04L25/49
CPC classification number: H04B10/541 , G02F1/0121 , G02F1/2257 , H04B10/505 , H04L25/4917
Abstract: An optical modulator includes an optical waveguide including at least a first PN junction phase shifter and a second PN junction phase shifter. A driver circuit drives operation of the first and second PN junction phase shifters in response to a pulse amplitude modulated (PAM) analog signal having 2n levels. The PAM analog signal is generated by a digital to analog converter that receives an n-bit input signal. In an implementation, the optical waveguide and PN junction phase shifters are formed on a first integrated circuit chip and the driver circuit is formed on a second integrated circuit chip that is stacked on and electrically connected to the first integrated circuit chip.
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公开(公告)号：US20170003571A1
公开(公告)日：2017-01-05
申请号：US15068704
申请日：2016-03-14
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor： Jean-Francois Carpentier , Patrick LeMaitre , Denis Pache
CPC classification number: G02F1/2255 , G02F1/0123 , G02F1/025 , G02F1/2257 , G02F2001/212
Abstract: An integrated modulator of the Mach-Zehnder type includes two optical arms containing waveguides with PN junctions and biasing circuits for reverse biasing the PN junctions in response to a control signal. The two optical arms are situated within a semiconductor substrate of a first element that also has an interconnection region. The biasing circuits are situated, in part, within a substrate of a second element that also contains an interconnection region. The first and second elements are rigidly attached to each other via their respective interconnection regions.
Abstract translation: Mach-Zehnder型集成调制器包括两个含有PN结的波导的光学臂和用于响应控制信号反向偏置PN结的偏置电路。 两个光学臂位于也具有互连区域的第一元件的半导体衬底内。 偏置电路部分地位于也包含互连区域的第二元件的衬底内。 第一和第二元件通过其相应的互连区域彼此刚性连接。
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