Coplanar waveguide
    1.
    发明授权
    Coplanar waveguide 有权
    共面波导

    公开(公告)号:US08902025B2

    公开(公告)日:2014-12-02

    申请号:US13736913

    申请日:2013-01-08

    CPC classification number: H01P3/003 H01P3/006 H01P3/082

    Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

    Abstract translation: 一个实施例涉及一种共面波导电子器件,其包括其上安装有信号带和至少一个接地平面的衬底。 信号带包括电连接在一起的相同级别的金属化的多条信号线,并且接地平面由导电材料制成并且包括多个孔。

    Coplanar waveguide
    2.
    发明授权
    Coplanar waveguide 有权
    共面波导

    公开(公告)号:US09450280B2

    公开(公告)日:2016-09-20

    申请号:US14527249

    申请日:2014-10-29

    CPC classification number: H01P3/003 H01P3/006 H01P3/082

    Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.

    Abstract translation: 在基板上形成共面波导电子器件。 波导包括信号带和接地平面。 信号带由两个或更多个电连接在一起的相同金属化水平的信号线形成。 接地平面由导电材料形成,其包括一排孔。

    COPLANAR WAVEGUIDE
    5.
    发明申请
    COPLANAR WAVEGUIDE 审中-公开
    共振波导

    公开(公告)号:US20150050001A1

    公开(公告)日:2015-02-19

    申请号:US14527249

    申请日:2014-10-29

    CPC classification number: H01P3/003 H01P3/006 H01P3/082

    Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.

    Abstract translation: 在基板上形成共面波导电子器件。 波导包括信号带和接地平面。 信号带由两个或更多个电连接在一起的相同金属化水平的信号线形成。 接地平面由导电材料形成,其包括一排孔。

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