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公开(公告)号:US08902025B2
公开(公告)日:2014-12-02
申请号:US13736913
申请日:2013-01-08
Applicant: STMicroelectronics SA
Inventor: Sébastien Pruvost , Frédéric Gianessello
Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.
Abstract translation: 一个实施例涉及一种共面波导电子器件,其包括其上安装有信号带和至少一个接地平面的衬底。 信号带包括电连接在一起的相同级别的金属化的多条信号线,并且接地平面由导电材料制成并且包括多个孔。
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公开(公告)号:US09450280B2
公开(公告)日:2016-09-20
申请号:US14527249
申请日:2014-10-29
Applicant: STMicroelectronics SA
Inventor: Sébastien Pruvost , Frederic Gianesello
Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.
Abstract translation: 在基板上形成共面波导电子器件。 波导包括信号带和接地平面。 信号带由两个或更多个电连接在一起的相同金属化水平的信号线形成。 接地平面由导电材料形成,其包括一排孔。
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公开(公告)号:US10181654B2
公开(公告)日:2019-01-15
申请号:US14869811
申请日:2015-09-29
Applicant: STMICROELECTRONICS SA
Inventor: Jean-Francois Carpentier , Sébastien Pruvost , Patrice Garcia , Pierre Busson , Pierre Dautriche
IPC: H01Q21/00 , H01Q23/00 , H01L23/498 , H01L23/66 , H01L23/00 , H01Q19/00 , H01Q19/10 , H01Q19/185 , H01L23/31 , H01L23/552
Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
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公开(公告)号:US20160020524A1
公开(公告)日:2016-01-21
申请号:US14869811
申请日:2015-09-29
Applicant: STMICROELECTRONICS SA
Inventor: Jean-Francois Carpentier , Sébastien Pruvost , Patrice Garcia , Pierre Busson , Pierre Dautriche
IPC: H01Q19/185 , H01L23/00 , H01L23/498 , H01L23/31 , H01Q19/10 , H01Q19/00
CPC classification number: H01Q21/0087 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L24/13 , H01L2223/6677 , H01L2224/1319 , H01L2224/13582 , H01L2224/16225 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01Q19/005 , H01Q19/10 , H01Q19/185 , H01Q21/0025 , H01Q21/0093 , H01Q23/00 , H01L2924/00
Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
Abstract translation: 一种毫米波收发器,包括形成插入件的板,其具有支撑互连网络的上表面,并且其下表面旨在通过凸块组装在印刷电路板上; 组装在所述插入件的上表面上的集成电路芯片; 由形成在插入件的上表面上的轨道制成的天线; 以及在每个天线前面的印刷电路板的上表面上的反射器,考虑到插入材料的介电常数,每个天线和反射板之间的有效距离在波长的四分之一左右 。
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公开(公告)号:US20150050001A1
公开(公告)日:2015-02-19
申请号:US14527249
申请日:2014-10-29
Applicant: STMicroelectronics SA
Inventor: Sébastien Pruvost , Frederic Gianesello
IPC: H01P3/00
Abstract: A coplanar waveguide electronic device is formed on a substrate. The waveguide includes a signal ribbon and a ground plane. The signal ribbon is formed of two or more signal lines of a same level of metallization that are electrically connected together. The ground plane is formed of an electrically conducting material which includes rows of holes.
Abstract translation: 在基板上形成共面波导电子器件。 波导包括信号带和接地平面。 信号带由两个或更多个电连接在一起的相同金属化水平的信号线形成。 接地平面由导电材料形成,其包括一排孔。
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