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Patent Agency Ranking
公开(公告)号：US20130248887A1
公开(公告)日：2013-09-26
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L31/0203 , H01L31/18
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
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公开(公告)号：US09105766B2
公开(公告)日：2015-08-11
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L33/48 , H01L31/0203 , H01L31/18 , G01S17/02 , H01L25/16 , H03K17/94 , G01S7/481 , H03K17/945
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
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公开(公告)号：US10897822B2
公开(公告)日：2021-01-19
申请号：US16815554
申请日：2020-03-11
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Fabien Quercia , David Auchere , Norbert Chevrier , Fabien Corsat
Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.
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公开(公告)号：US20170317059A1
公开(公告)日：2017-11-02
申请号：US15364452
申请日：2016-11-30
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Benoit Besancon , Norbert Chevrier , Jean-Michel Riviere
IPC: H01L25/065 , H01L23/367
CPC classification number: H01L25/0657 , H01L23/3128 , H01L23/367 , H01L23/4334 , H01L23/49833 , H01L2224/04105 , H01L2224/16227 , H01L2224/18 , H01L2224/73259 , H01L2225/06517 , H01L2225/0652 , H01L2225/06558 , H01L2225/06575 , H01L2225/06582 , H01L2225/06589
Abstract: An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.
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公开(公告)号：US20170345805A1
公开(公告)日：2017-11-30
申请号：US15166726
申请日：2016-05-27
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Norbert Chevrier , Benoit Besancon , Jean-Michel Riviere
IPC: H01L25/16 , H01L25/00 , H01L23/522 , H01L21/768 , H01L23/31 , H01L23/29 , H01L27/02 , H01L23/00
CPC classification number: H01L25/16 , H01L21/76804 , H01L21/76879 , H01L23/3135 , H01L23/5226 , H01L23/60 , H01L24/16 , H01L25/50 , H01L27/0251 , H01L2224/16227 , H01L2224/48227 , H01L2924/15192 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331
Abstract: Disclosed herein is an electronic device including a substrate having a conductive area formed thereon. A first molding level is stacked on the substrate. A die is formed on the substrate and within the first molding level. A second molding level is stacked on the first molding level. At least one passive component is within the second molding level. A conductive structure extends between the second molding level and the substrate and electrically couples the at least one passive component to the conductive area.
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