-
公开(公告)号：US20220155519A1
公开(公告)日：2022-05-19
申请号：US17649520
申请日：2022-01-31
Inventor： Frédéric Boeuf , Luca Maggi
Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
-
公开(公告)号：US20200310027A1
公开(公告)日：2020-10-01
申请号：US16821370
申请日：2020-03-17
Inventor： Frédéric Boeuf , Luca Maggi
Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
-
公开(公告)号：US11269141B2
公开(公告)日：2022-03-08
申请号：US16821370
申请日：2020-03-17
Inventor： Frédéric Boeuf , Luca Maggi
Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
-
公开(公告)号：US20230194787A1
公开(公告)日：2023-06-22
申请号：US18167392
申请日：2023-02-10
Inventor： Frédéric BOEUF , Luca Maggi
CPC classification number: G02B6/124 , G02B6/34 , G02B6/43 , G02B6/30 , G02B6/12004 , G02B6/136 , G02B2006/12061
Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
-
Patent Agency Ranking
公开(公告)号：US11609378B2
公开(公告)日：2023-03-21
申请号：US17649520
申请日：2022-01-31
Inventor： Frédéric Boeuf , Luca Maggi
Abstract: A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
-
公开(公告)号：US11022522B2
公开(公告)日：2021-06-01
申请号：US16048074
申请日：2018-07-27
Applicant: STMicroelectronics S.r.I.
Inventor： Marco Piazza , Antonio Canciamilla , Piero Orlandi , Luca Maggi
IPC: G01N11/00 , G01M11/00 , G02B6/293 , G01M11/02 , G01R31/3185 , G01R31/317
Abstract: A photonic testing device includes a substrate, an optical device under test (DUT) disposed over the substrate, and an optical input circuit disposed over the substrate. The optical input circuit includes a first plurality of inputs each configured to transmit a respective optical test signal of a plurality of optical test signals. Each of the plurality of optical test signals includes a respective dominant wavelength of a plurality of dominant wavelengths. The optical input circuit further includes an output coupled to an input waveguide of the optical DUT. The output is configured to transmit a combined optical test signal comprising the plurality of optical test signals.
-
7.发明授权Packaged device exposed to environmental air and liquids and manufacturing method thereof 有权暴露于环境空气和液体的包装设备及其制造方法公开(公告)号：US09011776B2
公开(公告)日：2015-04-21
申请号：US14013730
申请日：2013-08-29
Applicant: STMicroelectronics S.r.I.
Inventor： Federico Giovanni Ziglioli , Fulvio Vittorio Fontana , Luca Maggi
CPC classification number: B81B7/0077 , B81B7/0058 , B81B2201/0264 , B81C1/00333 , B81C2203/0118 , H01L2224/48091 , H01L2224/48145 , H04R1/086 , H04R19/04 , H04R2201/003 , H01L2924/00014 , H01L2924/00012
Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.
Abstract translation: 一种封装器件，其中芯片的至少一个敏感部分被封装在由封装形成的腔室中。 该包装具有透气区域，具有多个孔和拒水结构，以使得能够在外部环境和室之间通过空气并阻止液体的通过。
-
公开(公告)号：US20200033228A1
公开(公告)日：2020-01-30
申请号：US16048074
申请日：2018-07-27
Applicant: STMicroelectronics S.r.I
Inventor： Marco Piazza , Antonio Canciamilla , Piero Orlandi , Luca Maggi
IPC: G01M11/00 , G02B6/293 , G01R31/317 , G01R31/3185 , G01M11/02
Abstract: A photonic testing device includes a substrate, an optical device under test (DUT) disposed over the substrate, and an optical input circuit disposed over the substrate. The optical input circuit includes a first plurality of inputs each configured to transmit a respective optical test signal of a plurality of optical test signals. Each of the plurality of optical test signals includes a respective dominant wavelength of a plurality of dominant wavelengths. The optical input circuit further includes an output coupled to an input waveguide of the optical DUT. The output is configured to transmit a combined optical test signal comprising the plurality of optical test signals.
-
公开(公告)号：US10033464B2
公开(公告)日：2018-07-24
申请号：US14282394
申请日：2014-05-20
Applicant: STMICROELECTRONICS S.r.I.
Inventor： Luca Maggi , Antonio Fincato , Salvatore Mario Rotolo , Matteo Alessio Traldi , Luigi Verga , Mark Andrew Shaw
IPC: H04B10/00 , H04B13/02 , H04B10/40 , G02B6/42 , H04B10/2575
Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.017 seconds)
