公开(公告)号：US20140264852A1

公开(公告)日：2014-09-18

申请号：US14291749

申请日：2014-05-30

申请人： STMicroelectronics S.r.l. ,  POLITECNICO DI MILANO

发明人： Gian Pietro Vanalli ,  Giovanni Campardo ,  Aldo Losavio ,  Paolo Pulici ,  Pier Paolo Stoppino

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/06 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/10126 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/04941 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.

摘要翻译： 一种用于制造具有彼此相对的第一表面和第二表面的基板中的通孔的焊料凸块的方法。 该方法包括以下步骤：从每个通孔的第一表面形成在基板中延伸的盲孔，并用导电填料填充每个盲孔; 每个填料的最深部分包括由焊料材料制成的凸起部分。 所述方法还包括从所述第二表面移除所述基板的一部分以至少具有从所述基板突出的凸起部的步骤。 每个填料的非突出部分限定相应的通孔，凸起部分限定相应的凸块。

公开(公告)号：US08928123B2

公开(公告)日：2015-01-06

申请号：US14291749

申请日：2014-05-30

申请人： STMicroelectronics S.r.l. ,  Politecnico di Milano

发明人： Gian Pietro Vanalli ,  Giovanni Campardo ,  Aldo Losavio ,  Paolo Pulici ,  Pier Paolo Stoppino

IPC分类号： H01L29/40 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L24/06 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/10126 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/04941 ,  H01L2224/13099 ,  H01L2924/00

摘要： A substrate has a first surface and a second surface opposed to each other. A blind hole is formed in the substrate extending from the first surface at a location for each through via. Each blind hole is filled with a conductive filler; a deepest part of each filler forming a bump portion made of a solder material. Part of the substrate extending from the second surface is removed to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding solder bump.

摘要翻译： 衬底具有彼此相对的第一表面和第二表面。 在每个通孔的位置处，从第一表面延伸的基板上形成盲孔。 每个盲孔填充有导电填料; 每个填料的最深部分形成由焊料材料制成的凸起部分。 移除从第二表面延伸的基板的一部分，以至少凸起部分从基板突出。 每个填料的非突出部分限定相应的通孔，凸起部分限定相应的焊料凸块。