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公开(公告)号：US20220225500A1
公开(公告)日：2022-07-14
申请号：US17605939
申请日：2020-05-15
发明人： Junichi MOTOMURA , Koji NITTA , Shoichiro SAKAI , Mari SOGABE , Mitsutaka TSUBOKURA , Akira TSUCHIKO , Masashi IWAMOTO
摘要： The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 μm or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 μg/cm2 or more and 0.40 μg/cm2 or less.
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公开(公告)号：US20230232540A1
公开(公告)日：2023-07-20
申请号：US17998966
申请日：2021-11-16
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
发明人： Shoichiro SAKAI , Ryuta OHSUKA , Koji NITTA , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
CPC分类号： H05K3/103 , C22C19/05 , H05K1/0373 , H05K3/1258 , H05K2201/0212 , H05K2203/061 , H05K2203/176
摘要： In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) :
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.-
公开(公告)号：US20230212757A1
公开(公告)日：2023-07-06
申请号：US17998980
申请日：2021-11-16
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
发明人： Ryuta OHSUKA , Koji NITTA , Shoichiro SAKAI , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
摘要： A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.-
公开(公告)号：US20230164926A1
公开(公告)日：2023-05-25
申请号：US17922872
申请日：2020-05-20
发明人： Shoichiro SAKAI , Junichi MOTOMURA , Koji NITTA , Masashi IWAMOTO , Mitsutaka TSUBOKURA , Mari SOGABE , Akira TSUCHIKO
CPC分类号： H05K3/422 , H05K3/4644 , H05K1/115 , H05K1/09 , H05K2201/0355 , H05K2201/09509 , C23C18/38
摘要： A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater, the electroless copper plating layer includes palladium.
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公开(公告)号：US20240106045A1
公开(公告)日：2024-03-28
申请号：US18263588
申请日：2021-02-12
发明人： Akira TSUCHIKO , Kengo GOTO , Kazuhiro GOTO , Koji KASUYA , Yoshihiro TSUKUDA , Yusuke KUREISHI
IPC分类号： H01M50/198 , H01M50/172 , H01M50/193 , H01M50/197 , H01M50/562
CPC分类号： H01M50/198 , H01M50/172 , H01M50/193 , H01M50/197 , H01M50/562
摘要： A lead member includes a lead conductor having a first main surface and a second main surface opposite to the first main surface. The lead member includes a resin portion that covers the first main surface, the second main surface, and two side surfaces that are between both ends of the lead conductor, while exposing the both ends of the lead conductor in a first direction. The lead conductor includes a metal substrate and a surface treatment layer formed on at least a portion of a surface of the metal substrate, the surface treatment layer including chromium, oxygen, and fluorine. A moisture content of a portion of the surface treatment layer exposed from the resin portion, as measured by coulometric Karl Fischer titration at a vaporization temperature of 220° C., is 5.0 μg/cm2 or less.
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6.发明公开公开(公告)号：US20240186662A1
公开(公告)日：2024-06-06
申请号：US18443750
申请日：2024-02-16
发明人： Yutaka MATSUMURA , Kengo GOTO , Akira TSUCHIKO
IPC分类号： H01M50/534 , H01B3/30 , H01B7/02
CPC分类号： H01M50/534 , H01B3/307 , H01B7/0216
摘要： A lead wire for a nonaqueous electrolyte battery of the present disclosure has a conductor, and an insulating film having a plurality of layers and covering at least a part of the outer peripheral surface of the conductor, wherein the insulating film has a conductor-covering layer laminated on a surface of the conductor, a first insulating layer laminated on an outermost surface of the insulating film, and a second insulating layer laminated on an inner surface of the first insulating layer; the conductor-covering layer contains an acid-modified polyolefin; and the ratio (E1/E2) of an elastic modulus E1 of the first insulating layer at any one temperature in the range of 80° C. or more and 125° C. or less to an elastic modulus E2 of the second insulating layer at the same temperature as in the first insulating layer, is 0.10 or more and 10.00 or less.
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7.发明公开公开(公告)号：US20230207973A1
公开(公告)日：2023-06-29
申请号：US17913355
申请日：2021-12-27
发明人： Yutaka MATSUMURA , Kengo GOTO , Akira TSUCHIKO
IPC分类号： H01M50/526 , H01M50/503 , H01M50/129
CPC分类号： H01M50/526 , H01M50/503 , H01M50/129
摘要： A lead wire for a nonaqueous electrolyte battery has a conductor, and an insulating film having a plurality of layers and covering at least a part of the outer peripheral surface of the conductor, wherein the insulating film has a conductor-covering layer laminated on a surface of the conductor, a first insulating layer laminated on an outermost surface of the insulating film, and a second insulating layer laminated on an inner surface of the first insulating layer; the conductor-covering layer contains an acid-modified polyolefin; and the ratio (S1/S2) of a shear failure strength S1 of the first insulating layer at any one temperature in the range of 80° C. or more and 125° C. or less to a shear failure strength S2 of the second insulating layer at the same temperature as in the first insulating layer, is 0.33 or more and 3.0 or less.
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8.发明公开公开(公告)号：US20230207891A1
公开(公告)日：2023-06-29
申请号：US17913319
申请日：2021-12-27
发明人： Yutaka MATSUMURA , Kengo GOTO , Akira TSUCHIKO
IPC分类号： H01M10/42 , H01M50/124 , H01M10/653
CPC分类号： H01M10/4235 , H01M50/124 , H01M10/653
摘要： A lead wire for a nonaqueous electrolyte battery has a conductor, and an insulating film having a plurality of layers and covering at least a part of the outer peripheral surface of the conductor, wherein the insulating film has a conductor-covering layer laminated on a surface of the conductor, a first insulating layer laminated on an outermost surface of the insulating film, and a second insulating layer laminated on an inner surface of the first insulating layer; the conductor-covering layer contains an acid-modified polyolefin; and the ratio (E1/E2) of an elastic modulus E1 of the first insulating layer at any one temperature in the range of 80° C. or more and 125° C. or less to an elastic modulus E2 of the second insulating layer at the same temperature as in the first insulating layer, is 0.10 or more and 10.00 or less.
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