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公开(公告)号：US20120104134A1
公开(公告)日：2012-05-03
申请号：US13131699
申请日：2009-11-24
Applicant: Sadahilio Misumi
Inventor： Sadahilio Misumi
CPC classification number: H01L21/561 , C09J7/20 , C09J2201/36 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/67132 , H01L21/6835 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68336 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , H01L2924/0635 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/0532 , H01L2924/04642 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: The present invention relates to a semiconductor device manufacturing film roll, comprising a winding core in a cylindrical form, and a semiconductor device manufacturing film which is wound around the winding core into a roll form, wherein the diameter of the winding core is from 7.5 to 15.5 cm.
Abstract translation: 本发明涉及一种半导体器件制造薄膜卷，其包括圆柱形的卷绕芯和卷绕在卷芯上的半导体器件制造膜，其中绕组芯的直径为7.5至 15.5厘米
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