-
公开(公告)号：US07387119B2
公开(公告)日：2008-06-17
申请号：US11137048
申请日：2005-05-25
IPC分类号： B28D1/32
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.
摘要翻译： 用于具有一个或多个可变分度能力的切割基板（例如半导体晶片）的锯和两个或更多个叶片。 一个叶片可以横向或垂直地移动，而与一个或多个其它叶片无关。
-
2.发明授权公开(公告)号：US06196096B1
公开(公告)日：2001-03-06
申请号：US09434147
申请日：1999-11-04
IPC分类号： B26D300
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
-
公开(公告)号：US07155300B2
公开(公告)日：2006-12-26
申请号：US10401209
申请日：2003-03-27
申请人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
发明人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
IPC分类号： G06F19/00
CPC分类号： G06F11/006 , H01L2223/5444
摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC's. The ID codes of the IC's are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC's is then accessed, and additional repair procedures the IC's may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
-
4.发明授权公开(公告)号：US06932077B2
公开(公告)日：2005-08-23
申请号：US10701957
申请日：2003-11-05
IPC分类号： B23P17/00 , B26D3/00 , B28D1/32 , B28D5/02 , H01L21/00 , H01L21/301 , H01L23/58 , H01L29/00 , H05K3/02 , H05K3/20 , H05K3/30 , B24D4/00
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要翻译： 用于切割半导体晶片的半导体晶片锯包括可变横向分度能力和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。
-
5.发明授权公开(公告)号：US06897571B2
公开(公告)日：2005-05-24
申请号：US10263319
申请日：2002-10-01
IPC分类号： B23P17/00 , B26D3/00 , B28D1/32 , B28D5/02 , H01L21/00 , H01L21/301 , H01L23/58 , H01L29/00 , H05K3/02 , H05K3/20 , H05K3/30
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers including a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要翻译： 半导体晶片锯及其使用方法，用于切割包括具有可变侧向分度能力的晶片锯和多个叶片的半导体晶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。
-
6.发明授权公开(公告)号：US06250192B1
公开(公告)日：2001-06-26
申请号：US08747299
申请日：1996-11-12
IPC分类号： B26D124
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要翻译： 公开了一种半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可以将具有多个不同尺寸的半导体器件的晶片骰子切割成其选择性分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。
-
7.发明授权Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 失效采用多指数技术的锯切方法和由此制造的半导体器件结构公开(公告)号：US06687990B2
公开(公告)日：2004-02-10
申请号：US10223923
申请日：2002-08-20
IPC分类号： H05K302
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49789 , Y10T29/49798 , Y10T83/0259 , Y10T83/04 , Y10T83/0524 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.
摘要翻译： 公开了一种半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。 晶片锯也可以用于同时切断和电绝缘在相邻半导体器件上延伸的导线，从而连接线。
-
8.发明授权公开(公告)号：US06553276B2
公开(公告)日：2003-04-22
申请号：US10071961
申请日：2002-02-05
申请人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O Jacobson , James M. Wark , Alan G. Wood
发明人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O Jacobson , James M. Wark , Alan G. Wood
IPC分类号： G06F1900
CPC分类号： G06F11/006 , H01L2223/5444
摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC's. The ID codes of the IC's are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC's is then accessed, and additional repair procedures the IC's may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
摘要翻译： 一种集成电路（IC）制造过程中的发明方法，用于使用关于在探针上的IC进行的修复程序的数据，以确定是否在制造过程中稍后进行进一步的修复，包括将数据与每个的保险丝ID相关联地存储 IC的。 例如，在制造过程中，IC的ID代码将自动读取，例如打开/短路测试。 然后访问与IC的ID代码相关联存储的数据，并且根据访问的数据选择IC可能经历的附加修复过程。 因此，例如，访问的数据可以指示IC不可修复，因此IC可以直接进入废料仓，而不必被查询以确定其是否可修复，如在传统IC制造过程中所必需的。
-
9.发明授权Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 失效用于锯切晶片的装置，其采用用于多个管芯尺寸的多个分度技术公开(公告)号：US06459105B2
公开(公告)日：2002-10-01
申请号：US09864737
申请日：2001-05-23
IPC分类号： H01L2978
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要翻译： 半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。
-
10.发明授权公开(公告)号：US06255196B1
公开(公告)日：2001-07-03
申请号：US09567262
申请日：2000-05-09
IPC分类号： H01L2130
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
-
-
-
-
-
-
-
-
-
搜索结果
884 条记录 (耗时 0.028 秒)
