摘要:
A table saw in one embodiment includes a swing arm assembly movable along a swing path between a first swing arm position whereat a portion of a shaping device supported by the swing arm assembly extends above a work-piece support surface and a second swing arm position, a first link arm with a first tracking component and a first slot, the first tracking component slidingly engaged with the swing arm assembly, a second link arm with a second tracking component engaged with the first slot, an actuator configured to pivot the second link arm from a first position whereat force from the first link arm acting on the tracking component is directed at a second link arm pivot toward a second position whereat the force is not directed at the second link arm pivot, and a control system configured to actuate the actuator in response to a sensed condition.
摘要:
A rotary trimmer for cutting and/or trimming paper and related sheet material is disclosed. The rotary trimmer comprises a trimmer housing having: (i) a first end portion; (ii) a second end portion; and (iii) a cutting platform having: (a) a first platform; (b) a second platform; and (c) a base platform. The first and the second platforms are pivotably connected at least indirectly to (1) the base platform; and/or (2) the first and the second end portions. The rotary trimmer further includes a blade carriage guide disposed between the first and the second end portions and a blade carriage having one or more cutting blades, and slidably mounted to the blade carriage guide wherein the blade carriage can slide along the blade carriage guide to cut and/or trim a sheet or sheet-like material positioned on the cutting platform. A method of using a rotary trimmer is also disclosed.
摘要:
A perforating equipment (111) for continuous forms in movement comprises tree transversal perforating device (54, 56, 57) for executing transversal perforations on continuous forms (58) to be divided in three longitudinal sections and continuous forms to be divided in two longitudinal sections. Each perforating device includes a contrast member (61, 62, 79), a blade support mounting a blade (116a, 117a, 118a) for the three section form and a blade (116b, 117b, 118b) for the two section form, a blade servomechanism (73, 74, 85) and an activation group (104, 106, 107). The blade servomechanism rotates the blade support for a condition of interference of a blade in the position of perforation; and the activation group causes the contrast member to contrast a corresponding blade for the perforations of the forms to be divided into three sections, or the forms to be divided into two longitudinal sections.
摘要:
A method for manufacturing antenna elements for use with wireless communication devices comprises a number of cutting techniques that allow the size of the antenna elements to be adjusted. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
摘要:
An information carrier system for a food article slicing machine. The system is for reading data from removable parts of the slicing machine. The system has a data carrier located on one or more removable parts for storing data and a head for reading data from the data carrier or for writing data to the data carrier guides. A shear support is one of the removable parts.
摘要:
A knife blade retraction mechanism for a food article slicing machine. The mechanism retracts the slicing blade from the slicing plane during the dwell between sliced groups to prevent scrap generation. The mechanism also has a knife blade brake to quickly top the slicing blade.
摘要:
A food article end location detecting system for a food article slicing machine. The system includes a sensor located so that each food article passes a sensing range of the sensor as the food articles are loaded onto a food article feed apparatus. The system has instructions for calculating the length of each food article based on a location value provided by the sensor. The system also comprises a food article end disposal mechanism. The disposal mechanism has a transport for receiving said food article ends and for removing said food article ends from said food article path. The disposal mechanism also has a paddle for displacing food article ends from the transport.
摘要:
An apparatus for slitting a web moving along a path in a transport direction has a support transversely shiftable relative to the web adjacent the path, a drive shaft extending transversely of the direction adjacent the path and substantially nonmovable transversely of the path, and a drive gear on the support rotationally coupled gear to the drive shaft and shiftable along the shaft. A mount shiftable toward and away from the shaft on the support carries at least one driven gear and a driven blade fixed to and rotatable with the driven gear. Another blade is juxtaposed with the driven blade and flanks the path therewith. An actuator can shift the mount between a cutting position with the blades closely juxtaposed and the driven gear meshing with the drive gear and a retracted position with the blades separated and the driven gear out of mesh with the drive gear.
摘要:
A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要:
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers including a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.