中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

14 records (took 0.014 seconds)

    LASER APPARATUS AND LASER MACHINING METHOD
    2.
    发明申请
    LASER APPARATUS AND LASER MACHINING METHOD 有权

    公开(公告)号：US20210053159A1

    公开(公告)日：2021-02-25

    申请号：US16862815

    申请日：2020-04-30

    Applicant: SAMSUNG DISPLAY CO., LTD.

    Inventor： Sung Yong LEE ,  Toshinaru SUZUKI ,  Seung Ho MYOUNG ,  Gyeong Hee HAN ,  Gyoo Wan HAN

    IPC: B23K26/38 ,  B23K26/70 ,  B23K26/12

    Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

    LASER CRYSTALLIZATION APPARATUS
    4.
    发明申请
    LASER CRYSTALLIZATION APPARATUS 有权

    公开(公告)号：US20220214531A1

    公开(公告)日：2022-07-07

    申请号：US17509300

    申请日：2021-10-25

    Applicant: Samsung Display Co., LTD.

    Inventor： Akifumi SANGU ,  Je Kil RYU ,  Cheol Ho PARK ,  Hae Sook LEE ,  Jin Hong JEUN ,  Young Su CHAE ,  Gyoo Wan HAN

    IPC: G02B17/00 ,  H01L21/67 ,  B23K26/50

    Abstract: A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

    LASER PROCESSING APPARATUS
    5.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20180157006A1

    公开(公告)日：2018-06-07

    申请号：US15793698

    申请日：2017-10-25

    Applicant: Samsung Display Co. Ltd.

    Inventor： Emil ASLANOV ,  Je Kil RYU ,  Hae Sook LEE ,  Kyung Hoon CHUNG ,  Gyoo Wan HAN

    IPC: G02B13/00 ,  G02B26/10 ,  B23K26/06

    Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

    METHOD FOR CUTTING SUBSTRATE
    6.
    发明申请
    METHOD FOR CUTTING SUBSTRATE 有权
    切割基板的方法

    公开(公告)号：US20150108089A1

    公开(公告)日：2015-04-23

    申请号：US14324825

    申请日：2014-07-07

    Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

    Inventor： Il Young JEONG ,  Tae Yong KIM ,  Cheol Lae ROH ,  Je Kil RYU ,  Jeong Hun WOO ,  Gyoo Wan HAN ,  Ki Su HAN ,  Tae Hyoung CHO ,  Jong Nam MOON

    IPC: B44C1/22

    CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

    Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。

    LASER APPARATUS AND LASER MACHINING METHOD
    7.
    发明申请
    LASER APPARATUS AND LASER MACHINING METHOD 有权

    公开(公告)号：US20250025964A1

    公开(公告)日：2025-01-23

    申请号：US18906406

    申请日：2024-10-04

    Applicant: SAMSUNG DISPLAY CO., LTD.

    Inventor： Sung Yong LEE ,  Toshinaru SUZUKI ,  Seung Ho MYOUNG ,  Gyeong Hee HAN ,  Gyoo Wan HAN

    IPC: B23K26/38 ,  B23K26/12 ,  B23K26/70 ,  B23K101/40

    Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

    SHEARING INTERFEROMETER FOR LASER
    9.
    发明申请
    SHEARING INTERFEROMETER FOR LASER 审中-公开

    公开(公告)号：US20190154514A1

    公开(公告)日：2019-05-23

    申请号：US16154807

    申请日：2018-10-09

    Applicant: SAMSUNG DISPLAY CO., LTD.

    Inventor： Emil ASLANOV ,  Alexander VORONOV ,  Gyoo Wan HAN

    IPC: G01J9/02

    Abstract: A shearing interferometer includes first and second shearing plates disposed opposite to each other. The first shearing plate includes a first front surface and a first back surface, and splits an input beam input to the first front surface into first and second beams reflected at the first front and back surfaces, respectively. The second shearing plate includes a second front surface and a second back surface. The second shearing plate splits the first beam into third and fourth beams reflected at the second front and back surfaces, respectively, and splits the second beam into fifth and sixth beams reflected at the second front and back surfaces, respectively. Each of the first and second shearing plates has a thickness which limits a phase delay between the fourth beam and the fifth beam to a degree determined to allow interference to occur between the fourth beam and the fifth beam.

Patent Agency Ranking