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公开(公告)号:US20230343507A1
公开(公告)日:2023-10-26
申请号:US18100094
申请日:2023-01-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , In Young Kang
CPC classification number: H01F27/292 , H01F27/324
Abstract: A coil component includes a body, a supporting member disposed within the body, a coil portion including a coil pattern disposed on at least one surface of the supporting member, a via pad connected to the coil pattern, and a via connected to the via pad, and an external electrode disposed on the body and connected to the coil portion. The via includes a plurality of side surfaces, one or more of the side surfaces is covered by the supporting member, and at least a portion of two or more of the side surfaces is non-covered by the supporting member.
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公开(公告)号:US10855249B2
公开(公告)日:2020-12-01
申请号:US16522093
申请日:2019-07-25
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Kyung Lee , Jae Sang Lee , Ran Hee Shin , In Young Kang , Sung Sun Kim , Sung Han
Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.
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公开(公告)号:US10756700B2
公开(公告)日:2020-08-25
申请号:US15638809
申请日:2017-06-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Sung Han , Jae Chang Lee , Won Han , Tae Yoon Kim , Jong Woon Kim , Tae Kyung Lee , Moon Chul Lee , Tae Hun Lee , Sung Min Cho , In Young Kang
Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.
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公开(公告)号:US11901131B2
公开(公告)日:2024-02-13
申请号:US17466508
申请日:2021-09-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyo Yeol Lee , Seung Hun Han , In Young Kang , Jung Min Kim , Jeong Ryeol Kim
Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.
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公开(公告)号:US11705283B2
公开(公告)日:2023-07-18
申请号:US17468240
申请日:2021-09-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyo Yeol Lee , Seung Hun Han , In Young Kang , Jung Min Kim , Jeong Ryeol Kim
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/2325
Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.
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公开(公告)号:US10446324B2
公开(公告)日:2019-10-15
申请号:US15651617
申请日:2017-07-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyo Yeol Lee , Hai Joon Lee , Seung Mo Lim , Ho Phil Jung , In Young Kang , Yun Hee Kim , Yun Sung Kang
Abstract: A thin film capacitor includes a body including alternately stacked first and second electrode layers and dielectric layers on a substrate, the second electrode layer including a second lower electrode layer and a second upper electrode layer formed on the second lower electrode layer, the second lower electrode layer including a material having a higher band gap energy than the first electrode layer and the second upper electrode layer.
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公开(公告)号:US10199166B2
公开(公告)日:2019-02-05
申请号:US15806112
申请日:2017-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: No Il Park , Byeong Cheol Moon , Il Ro Lee , Hyun Ho Shin , Seung Mo Lim , In Young Kang
Abstract: A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.
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公开(公告)号:US11881346B2
公开(公告)日:2024-01-23
申请号:US16530407
申请日:2019-08-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: In Young Kang , Byeong Cheol Moon , Doo Ho Park , Tai Yon Cho , No Il Park , Seung Mo Lim , Tae Jun Choi , Jeong Hoon Ryou
CPC classification number: H01F27/29 , H01F27/2823
Abstract: A coil electronic component includes a body having one surface and the other surface, opposing each other, and a plurality of wall surfaces respectively connecting the one surface and the other surface of the body, first and second recesses, respectively formed in both end surfaces of the body opposing each other among the plurality of wall surfaces of the body, extending to the one surface of the body, a wound coil, embedded in the body, including first and second lead-out portions, a first external electrode disposed along an internal wall of the first recess and the one surface of the body and connected to the first lead-out portion, and a second external electrode disposed along an internal wall of the second recess and the one surface of the body and connected to the first lead-out portion. The first and second external electrodes are spaced apart from each other.
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公开(公告)号:US20210134509A1
公开(公告)日:2021-05-06
申请号:US15931161
申请日:2020-05-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kwang Il Park , In Suk Kim , Young Sun Kim , Sung Hee Kim , In Young Kang
Abstract: A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.
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公开(公告)号:US10554194B2
公开(公告)日:2020-02-04
申请号:US16224025
申请日:2018-12-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Kyung Lee , In Young Kang , Ran Hee Shin , Jin Suk Son
Abstract: A bulk acoustic resonator includes a substrate, a first electrode disposed above the substrate, a piezoelectric body disposed on the first electrode and including a plurality of piezoelectric layers each including aluminum nitride with a doping material, and a second electrode disposed on the piezoelectric body, where at least one of the piezoelectric layers is a compressive piezoelectric layer formed under compressive stress.
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