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1.发明授权公开(公告)号：US08987904B2
公开(公告)日：2015-03-24
申请号：US13900612
申请日：2013-05-23
发明人： Gi-Jun Park , Won-Keun Kim , Teak-Hoon Lee , Chang-Seong Jeon , Young-Kun Jee
CPC分类号： H01L24/81 , H01L21/50 , H01L21/56 , H01L21/563 , H01L21/673 , H01L21/67346 , H01L21/6835 , H01L23/3128 , H01L23/48 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00
摘要： A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
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2.发明授权Substrate of semiconductor package and method of fabricating semiconductor package using the same 有权半导体封装的基板和使用其制造半导体封装的方法公开(公告)号：US09082871B2
公开(公告)日：2015-07-14
申请号：US14619155
申请日：2015-02-11
发明人： Gi-Jun Park , Won-Keun Kim , Teak-Hoon Lee , Chang-Seong Jeon , Young-Kun Jee
IPC分类号： H01L23/00 , H01L21/56 , H01L23/498 , H01L21/673 , H01L23/48 , H01L21/50
CPC分类号： H01L24/81 , H01L21/50 , H01L21/56 , H01L21/563 , H01L21/673 , H01L21/67346 , H01L21/6835 , H01L23/3128 , H01L23/48 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00
摘要： A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
摘要翻译： 半导体封装的基板包括具有第一表面和彼此面对的第二表面的第一布线基板，其上安装有半导体芯片的第一表面，第一支撑载体和将第二表面和第一支撑件连接的粘合膜 载体
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公开(公告)号：US10158888B2
公开(公告)日：2018-12-18
申请号：US14397358
申请日：2013-04-25
发明人： Sung-Ryeul Rhyu , Kyung-Mo Park , Yiling Xu , Gi-Jun Park , Jang-Won Lee , Kyu-Heon Kim , Gwang-Hoon Park , Doug-Young Suh
IPC分类号： H04N5/765 , H04N19/85 , H04N21/432 , H04N21/854 , H04N21/2343 , H04N21/462
摘要： A method and an apparatus for reproducing video data are provided. The method includes the steps of extracting a coded video data stream and video data attribute information from the stored video file, extracting samples relevant to an expanded time layer from the extracted video data stream on the basis of the location information of the sample which allows for temporal layer access contailed in the video data attribute information, and restoring and reproducing the extracted samples.
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公开(公告)号：US20150085940A1
公开(公告)日：2015-03-26
申请号：US14397358
申请日：2013-04-25
发明人： Sung-Ryeul Rhyu , Kyung-Mo Park , Yiling Xu , Gi-Jun Park , Jang-Won Lee , Kyu-Heon Kim , Gwang-Hoon Park , Doug-Young Suh
IPC分类号： H04N19/85
CPC分类号： H04N19/85 , H04N5/765 , H04N21/234327 , H04N21/4325 , H04N21/4621 , H04N21/85406
摘要： A method and an apparatus for reproducing video data are provided. The method includes the steps of extracting a coded video data stream and video data attribute information from the stored video file, extracting samples relevant to an expanded time layer from the extracted video data stream on the basis of the location information of the sample which allows for temporal layer access contailed in the video data attribute information, and restoring and reproducing the extracted samples.
摘要翻译： 提供了一种用于再现视频数据的方法和装置。 该方法包括以下步骤：从存储的视频文件中提取编码的视频数据流和视频数据属性信息，根据所提取的视频数据流的样本的位置信息提取与扩展时间层相关的样本， 视频数据属性信息中的时间层访问，以及恢复和再现提取的样本。
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