公开(公告)号：US09625522B2

公开(公告)日：2017-04-18

申请号：US14725512

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Guen Iy ,  Bo-Seong Park

IPC: G01R31/00 ,  G01R31/28 ,  G01R31/26 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R31/2889 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/07314 ,  G01R1/07378 ,  G01R31/2601 ,  G01R31/2891 ,  G01R31/2896

Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

公开(公告)号：US20160124042A1

公开(公告)日：2016-05-05

申请号：US14725512

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Guen Iy ,  Bo-Seong Park

IPC: G01R31/28 ,  G01R1/04 ,  G01R31/26

CPC classification number: G01R31/2889 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/07314 ,  G01R1/07378 ,  G01R31/2601 ,  G01R31/2891 ,  G01R31/2896

Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

Abstract translation: 适配器结构包括主适配器，第一子适配器，第二子适配器和第一驱动机构。 主适配器在一个插座上。 主适配器有一个开口。 第一子适配器沿第一方向可移动地容纳在主适配器的开口中。 第一子适配器被配置为支撑半导体封装的第一侧表面。 第二子适配器沿第一方向和第二方向可移动地容纳在主适配器的开口中。 第二子适配器面向第一子适配器以支撑半导体封装的第二侧表面。 第一驱动机构构造成沿第二方向移动第二子适配器。 因此，适配器结构可以将具有不同尺寸的半导体封装引导到插座。

公开(公告)号：US20160139198A1

公开(公告)日：2016-05-19

申请号：US14920252

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-Seong Park ,  Joo-In Song ,  Min-Woo Kim ,  Hye-ju Kim ,  Chang-Ho Lee ,  Jong-Hwan Lim

IPC: G01R31/28 ,  F24F7/08

CPC classification number: G01R31/2874 ,  G11C29/06 ,  G11C29/56016

Abstract: An apparatus for testing electronic devices may include a test chamber, a heating unit, a cooling unit and a controller. The test chamber may include a plurality of slots configured to receive the electronic devices. The heating unit may heat the electronic devices in the slots. The cooling unit may individually cool the electronic devices in the slots. The controller may selectively control operations of the heating unit and the cooling unit in accordance with temperatures in the slots. Thus, the electronic devices may be provided with a uniform test temperature so that reliability of test results may be improved.

Abstract translation: 用于测试电子设备的设备可以包括测试室，加热单元，冷却单元和控制器。 测试室可以包括被配置为接收电子设备的多个狭槽。 加热单元可以加热槽中的电子设备。 冷却单元可以单独地冷却槽中的电子设备。 控制器可以根据槽中的温度选择性地控制加热单元和冷却单元的操作。 因此，电子设备可以具有均匀的测试温度，从而可以提高测试结果的可靠性。