Semiconductor memory device and a method of manufacturing the same

    公开(公告)号:US12200922B2

    公开(公告)日:2025-01-14

    申请号:US18116883

    申请日:2023-03-03

    Abstract: A semiconductor memory device includes a device isolation pattern on a substrate to define an active region, a word line in the substrate, to intersect the active region, a first dopant region in the active region as at a first side of the word line, a second dopant region in the active region at a second side of the word line, a bit line connected to the first dopant region and intersecting the word line, a bit line contact connecting the bit line to the first dopant region, a landing pad on the second dopant region, and a storage node contact connecting the landing pad to the second dopant region, the storage node contact including a first portion in contact with the second dopant region, the first portion including a single-crystal silicon, and a second portion on the first portion and including a poly-silicon.

    SEMICONDUCTOR DEVICE
    2.
    发明申请

    公开(公告)号:US20250081429A1

    公开(公告)日:2025-03-06

    申请号:US18664753

    申请日:2024-05-15

    Abstract: A semiconductor device includes a substrate, an active region defined by a device isolation layer within the substrate, a word line extending in a first horizontal direction within the substrate, a bit line extending on the substrate in a second horizontal direction intersecting with the first horizontal direction and including a metal-based conductive pattern, a first spacer on a sidewall of the metal-based conductive pattern, a second spacer on the first spacer, a direct contact in a direct contact hole exposing the active region and electrically connecting the bit line to the active region, and a buried spacer on a lower sidewall of the direct contact within the direct contact hole, wherein the second spacer contacts a sidewall of the direct contact on the sidewall of the direct contact.

    SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220173107A1

    公开(公告)日:2022-06-02

    申请号:US17358055

    申请日:2021-06-25

    Abstract: A semiconductor memory device includes a device isolation pattern on a substrate to define an active region, a word line in the substrate, to intersect the active region, a first dopant region in the active region as at a first side of the word line, a second dopant region in the active region at a second side of the word line, a bit line connected to the first dopant region and intersecting the word line, a bit line contact connecting the bit line to the first dopant region, a landing pad on the second dopant region, and a storage node contact connecting the landing pad to the second dopant region, the storage node contact including a first portion in contact with the second dopant region, the first portion including a single-crystal silicon, and a second portion on the first portion and including a poly-silicon.

    SEMICONDUCTOR DEVICE HAVING SOURCE/DRAIN REGIONS

    公开(公告)号:US20240389303A1

    公开(公告)日:2024-11-21

    申请号:US18663449

    申请日:2024-05-14

    Abstract: A semiconductor device includes an active region disposed in a substrate, a device isolation layer defining the active region, a gate structure disposed in the substrate and extending in a first horizontal direction to cross the active region, bit line structures crossing the gate structure and extending in a second horizontal direction, intersecting the first horizontal direction, and a contact plug between the bit line structures. The active region includes a first source/drain region, a second source/drain region, and a channel region. The first and second source/drain regions are spaced apart from each other by the gate structure. The first source/drain region includes a first lower region and a first upper region on the first lower region. The first lower region is a first crystal region, and the first upper region is a second crystal region, different from the first crystal region. The contact plug contacts the first upper region.

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