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公开(公告)号：US09985351B2
公开(公告)日：2018-05-29
申请号：US14808667
申请日：2015-07-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Suk Kim , Jin Kyu Bang , Kyung Bae Ko , Dong Hwan Kim
Abstract: A multi-band antenna is provided. The multi-band antenna includes a plurality of radiator patterns that are configured to operate according to different frequency bands, a plurality of feeding units that are respectively connected to different contact points of the antenna radiator for connecting feeding units of the plurality of feeding units to at least one radiator pattern included in the plurality of radiator patterns, and a switching unit configured to switch between feeding units of the plurality of feeding units for connecting at least one radiator pattern included in the plurality of radiator patterns to the switched feeding unit.
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公开(公告)号：US09935359B2
公开(公告)日：2018-04-03
申请号：US15180890
申请日：2016-06-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae Hyung Kim , Jin U Kim , Jin Kyu Bang , Dong Hwan Kim , Tae Gyu Kim , Ki Young Chang , Sung Yeul Hong
IPC: H01Q1/24 , H01Q1/52 , H01Q9/42 , H01Q21/28 , H01Q5/328 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H01Q5/371 , H01Q5/378
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H01Q1/521 , H01Q5/328 , H01Q5/371 , H01Q5/378 , H01Q9/42 , H01Q21/28
Abstract: An electronic device including a plurality of antennas is provided. The electronic device includes a first radiator including at least one matching block that is connected with a ground area and at least one side of the first radiator. The first radiator is configured to transmit and receive a first frequency signal through a first antenna resonance length corresponding to a first area of the first radiator, and to transmit and receive a second frequency signal through a second antenna resonance length corresponding to a second area opposite to the first area. A second radiator is connected with the ground area and is configured to transmit and receive a third frequency signal through a third antenna resonance length corresponding to a third area adjacent to the first radiator.
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Patent Agency Ranking
公开(公告)号：US20150132937A1
公开(公告)日：2015-05-14
申请号：US14444037
申请日：2014-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin Soak Kim , Gab Jin Nam , Dong Hwan Kim , Su Hwan Kim , Toshiro Nakanishi , Sung Kweon Baek , Tae Hyun An , Eun Ae Chung
IPC: H01L21/28
CPC classification number: H01L21/28185 , H01L29/495 , H01L29/4966 , H01L29/518 , H01L29/66545 , H01L29/6659 , H01L29/66795 , H01L29/7833
Abstract: There is provided a method of manufacturing a semiconductor device including: preparing a semiconductor substrate having an active region; forming a dielectric layer for gate insulation on the active region; forming a curing layer with a material containing germanium (Ge) on the dielectric layer; heat-treating the curing layer; and removing the curing layer. The germanium-containing material may be silicon germanium (SiGe) or germanium (Ge).
Abstract translation: 提供一种制造半导体器件的方法，包括：制备具有有源区的半导体衬底; 在所述有源区上形成用于栅极绝缘的介电层; 在介电层上形成含有锗（Ge）的材料的固化层; 热处理固化层; 并去除固化层。 含锗材料可以是硅锗（SiGe）或锗（Ge）。
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公开(公告)号：US10680337B2
公开(公告)日：2020-06-09
申请号：US14577365
申请日：2014-12-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Gyu Kim , Jin Kyu Bang , Hae Yeon Kim , Chong O Yoon , Dong Hwan Kim
Abstract: An antenna device for an electronic device for wireless communication is provided. The antenna device includes an antenna area connected to a feeding line and a ground line, such that the antenna area is configured to transmit/receive a signal of a first frequency band; and a branching feeding pattern branching from the feeding line and connected to one side of the antenna area, such that the branching feeding pattern is configured to enable the antenna area to transmit/receive a signal of a second frequency band.
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公开(公告)号：US20150188230A1
公开(公告)日：2015-07-02
申请号：US14577365
申请日：2014-12-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Gyu KIM , Jin Kyu Bang , Hae Yeon Kim , Chong O Yoon , Dong Hwan Kim
Abstract: An antenna device for an electronic device for wireless communication is provided. The antenna device includes an antenna area connected to a feeding line and a ground line, such that the antenna area is configured to transmit/receive a signal of a first frequency band; and a branching feeding pattern branching from the feeding line and connected to one side of the antenna area, such that the branching feeding pattern is configured to enable the antenna area to transmit/receive a signal of a second frequency band.
Abstract translation: 提供了一种用于无线通信的电子设备的天线装置。 天线装置包括连接到馈电线和接地线的天线区域，使得天线区域被配置为发送/接收第一频带的信号; 以及从所述馈电线分支并连接到所述天线区域的一侧的分支馈送模式，使得所述分支馈送模式被配置为使得所述天线区域能够发送/接收第二频带的信号。
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公开(公告)号：US09443735B2
公开(公告)日：2016-09-13
申请号：US14444037
申请日：2014-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin Soak Kim , Gab Jin Nam , Dong Hwan Kim , Su Hwan Kim , Toshiro Nakanishi , Sung Kweon Baek , Tae Hyun An , Eun Ae Chung
IPC: H01L21/336 , H01L21/762 , H01L21/28 , H01L29/51 , H01L29/66 , H01L29/78 , H01L29/49
CPC classification number: H01L21/28185 , H01L29/495 , H01L29/4966 , H01L29/518 , H01L29/66545 , H01L29/6659 , H01L29/66795 , H01L29/7833
Abstract: There is provided a method of manufacturing a semiconductor device including: preparing a semiconductor substrate having an active region; forming a dielectric layer for gate insulation on the active region; forming a curing layer with a material containing germanium (Ge) on the dielectric layer; heat-treating the curing layer; and removing the curing layer. The germanium-containing material may be silicon germanium (SiGe) or germanium (Ge).
Abstract translation: 提供一种制造半导体器件的方法，包括：制备具有有源区的半导体衬底; 在所述有源区上形成用于栅极绝缘的介电层; 在介电层上形成含有锗（Ge）的材料的固化层; 热处理固化层; 并去除固化层。 含锗材料可以是硅锗（SiGe）或锗（Ge）。
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公开(公告)号：US10608324B2
公开(公告)日：2020-03-31
申请号：US15720872
申请日：2017-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Ha Lee , Kyung Jae Lee , Jae Ho Lim , Dong Hwan Kim , Young Jun Kim , Un Kim , Jong Hoon Kim , Min Seok Park
Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.
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