公开(公告)号：US20030183887A1

公开(公告)日：2003-10-02

申请号：US10384495

申请日：2003-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L021/00 ,  H01L027/14 ,  H01L029/82

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。

公开(公告)号：US20030122205A1

公开(公告)日：2003-07-03

申请号：US10320679

申请日：2002-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

IPC: H01L027/14

CPC classification number: B81B3/0078 ,  B81B2203/0307 ,  B81C2201/0109

Abstract: A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.

Abstract translation: 一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。 沉积在基板上的牺牲层被图案化以具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。 如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。 如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。 因此，只有在浮动部分下面的牺牲层被去除。 由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。 此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

公开(公告)号：US20040226369A1

公开(公告)日：2004-11-18

申请号：US10744099

申请日：2003-12-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Seog-soo Hong

IPC: G01P015/14

CPC classification number: G01C19/5762 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053

Abstract: A vertical MEMS gyroscope by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.

Abstract translation: 通过水平驱动的垂直MEMS陀螺仪包括基板，固定在基板区域的上表面上的支撑层，浮动在基板上方的驱动结构，并且具有固定到支撑层的上表面的部分和 平行于固定部分，驱动结构具有能够在与基板平行的预定方向上振动的预定区域，与驱动结构固定在与驱动结构相同的平面上的检测结构，并且具有能够振动的预定区域 在相对于基板的垂直方向上，与位于驱动结构和检测结构上方的基板接合的盖晶片和形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测位移 的检测结构在垂直方向。

公开(公告)号：US20040203186A1

公开(公告)日：2004-10-14

申请号：US10686769

申请日：2003-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ci-moo Shong ,  Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jong-seok Kim ,  Chan-bong Jun ,  Seog-woo Hong ,  Jung-ho Kang

IPC: H01L021/44

CPC classification number: B81B7/0006 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.

Abstract translation: 在MEMS封装工艺中用于底切的金属布线方法包括在硅衬底上设置MEMS元件，将玻璃晶片焊接到其上设置有MEMS元件的硅衬底的上部，所述玻璃晶片具有形成在其中的孔，用于 连接金属布线，在孔中沉积用于金属布线的金属薄膜，并使沉积的薄金属膜离子化。 通过离子加热，该方法能够将金属布线连接到具有底切的通孔。

公开(公告)号：US20040155306A1

公开(公告)日：2004-08-12

申请号：US10773312

申请日：2004-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L027/14

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 使金属层平坦化直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。