公开(公告)号：US20150162195A1

公开(公告)日：2015-06-11

申请号：US14511191

申请日：2014-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Won HAN ,  Su-Jin KWON ,  Hye-Ryun KIM ,  Jae-Hyun KIM ,  Jung-Sik CHOI

IPC: H01L21/033 ,  H01L21/311 ,  H01L21/768 ,  C08L53/00

CPC classification number: H01L21/0337 ,  C08F297/026 ,  C08L53/00 ,  G03F7/0002 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/76816

Abstract: In a method of manufacturing a semiconductor device, a blend solution that includes a block copolymer and an adsorbent is prepared. The block copolymer is synthesized by a copolymerization between a first polymer unit and a second polymer unit having a hydrophilicity greater than that of the first polymer unit. The adsorbent on which the block copolymer is adsorbed is extracted. The block copolymer is separated from the adsorbent. The block copolymer is collected. The block copolymer may be used to form a mask on an object layer on a substrate and the mask used to etch the object layer.

Abstract translation: 在制造半导体器件的方法中，制备包括嵌段共聚物和吸附剂的共混溶液。 嵌段共聚物通过第一聚合物单元和亲水性大于第一聚合物单元的第二聚合物单元之间的共聚合成。 萃取其上吸附嵌段共聚物的吸附剂。 从吸附剂中分离出嵌段共聚物。 收集嵌段共聚物。 嵌段共聚物可以用于在基材上的物体层上形成掩模，并且掩模用于蚀刻物体层。