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公开(公告)号:US20240107763A1
公开(公告)日:2024-03-28
申请号:US18207774
申请日:2023-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghee CHUNG , Hyeongjin KIM , Joongshik SHIN , Jeehoon HAN
IPC: H10B43/27 , H01L23/522 , H01L23/528 , H01L25/065 , H10B41/10 , H10B41/27 , H10B41/35 , H10B41/40 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00
CPC classification number: H10B43/27 , H01L23/5226 , H01L23/5283 , H01L25/0652 , H10B41/10 , H10B41/27 , H10B41/35 , H10B41/40 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00 , H01L2225/06541
Abstract: A semiconductor device includes a source structure including a plate layer and first and second horizontal conductive layers stacked in order on the plate layer, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the source structure, a channel structure penetrating through the gate electrodes, extending in the first direction, and including a channel layer in contact with the first horizontal conductive layer, and a separation region penetrating through the gate electrodes and extending in the first direction and in a second direction perpendicular to the first direction, wherein the first horizontal conductive layer extends horizontally below the separation region and has a seam overlapping the separation region in the first direction.
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公开(公告)号:US20230378943A1
公开(公告)日:2023-11-23
申请号:US18156106
申请日:2023-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeongjin KIM , Hyohyun NAM , Dongki KIM , Dae Young LEE
CPC classification number: H03K5/00006 , H03K17/56
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system or a 6th-Generation (6G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system. A frequency multiplier of a wireless communication system is provided. The frequency multiplier includes an input circuit to which a local oscillator (LO) signal is input, a multiplier circuit having one end connected to the input circuit and another end connected to a lower terminal of a load circuit, a load circuit having an upper terminal connected to a voltage controller, and a voltage controller configured between the upper terminal of the load circuit and an input power source, wherein the voltage controller may be configured to drop a voltage between the input power source and the upper terminal of the load circuit and reinput a feedback voltage based on an upper terminal voltage of the load circuit to the voltage controller, and a method of multiplying a frequency using the same.
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公开(公告)号:US20240381641A1
公开(公告)日:2024-11-14
申请号:US18435342
申请日:2024-02-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungeun PARK , Solmi KWAK , Jinhyuk KIM , Hyeongjin KIM , Jeongyong SUNG , Minsoo SHIN , Seungjun SHIN , Joongshik SHIN , Sunghee CHUNG , Jeehoon HAN
Abstract: A vertical memory device may include a common source plate on a substrate including a first region and a second region; gate pattern structures on the common source plate and extending from the first region to the second region, wherein the gate pattern structures include gate patterns and first insulation layers, and wherein the adjacent gate pattern structures are spaced apart from each other; first separation patterns filling first openings between the adjacent gate pattern structures on the first region; second separation patterns filling second openings between the adjacent gate pattern structures on the second region, wherein at least one of the second separation patterns is connected to at least one of the first separation patterns, and wherein the second separation pattern has a shape different from a shape of the first separation pattern; and channel structures passing through the gate pattern structures on the first region.
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公开(公告)号:US20240130123A1
公开(公告)日:2024-04-18
申请号:US18208459
申请日:2023-06-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yejin PARK , Seung Yoon KIM , Heesuk KIM , Hyeongjin KIM , Sehee JANG , Minsoo SHIN , Seungjun SHIN , Sanghun CHUN , Jeehoon HAN , Jae-Hwang SIM , Jongseon AHN
IPC: H10B43/27 , H01L23/522 , H01L23/528 , H01L25/065 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/10 , H10B43/35 , H10B80/00
CPC classification number: H10B43/27 , H01L23/5226 , H01L23/5283 , H01L25/0652 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/10 , H10B43/35 , H10B80/00 , H01L2225/06541
Abstract: Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. A minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.
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公开(公告)号:US20230214168A1
公开(公告)日:2023-07-06
申请号:US18120913
申请日:2023-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeongjin KIM , Seungbum LEE
CPC classification number: G06F3/1454 , H04L47/25 , H04W28/06 , G06F3/0416
Abstract: A source device includes a wireless communication module, a memory, and a processor. The processor is configured to transmit screen image data, generated by the source device to be displayed on a sink device, to the sink device through the wireless communication module. The processor is also configured to determine whether a target application configured to change a transmission amount of user input data generated in a screen image that is based on the screen image data, by an input device connected to the sink device is being executed while the screen image is being displayed on the sink device. The processor is further configured to adjust a transmission bit rate of the screen image data by changing a transfer profile for transmitting the screen image data, based on a determination that the target application is being executed.
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公开(公告)号:US20220095297A1
公开(公告)日:2022-03-24
申请号:US17508537
申请日:2021-10-22
Applicant: Samsung Electronics Co, Ltd.
Inventor: Jinbong RYU , Hyeongjin KIM , Jongmoon PARK , Seongha LEE , Seoyeon HONG
Abstract: Disclosed is an electronic device including a wireless communication circuit, and a processor operably connected to the wireless communication circuit, wherein the processor is configured to identify a first channel for communication with an access point (AP) based on wireless fidelity (Wi-Fi) and a second channel for direct communication with an external electronic device based on Wi-Fi direct, reconfigure a capability of the electronic device related to direct communication with the external electronic device when the first channel and the second channel are different, and transmit information about the reconfigured capability of the electronic device to the external electronic device through the wireless communication circuit.
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