公开(公告)号：US20180351580A1

公开(公告)日：2018-12-06

申请号：US16057719

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Yoochang EUN

IPC: H03M13/23 ,  H04L1/00 ,  H03M13/41

CPC classification number: H03M13/23 ,  H03M13/4107 ,  H03M13/413 ,  H03M13/4169 ,  H04L1/0045 ,  H04L1/0059

Abstract: A convolutional decoder includes a first storage, a second storage, a branch metric processor to determine branch metrics for transitions of states from a start step to a last step according to input bit streams, an ACS processor to select maximum likelihood path metrics to determine a survival path according to the branch metrics and to update states of the start step to the first storage and the second storage alternately based on the selection of the maximum likelihood path metrics, and a trace back logic to selectively trace back the survival path based on the states of the start step stored in a selected storage among the first storage and the second storage.

公开(公告)号：US20230154886A1

公开(公告)日：2023-05-18

申请号：US18099092

申请日：2023-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Jaekyu SUNG

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/498

CPC classification number: H01L24/73 ,  H01L25/18 ,  H01L24/32 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L23/49816 ,  H01L2924/182 ,  H01L2924/1435 ,  H01L2924/1431 ,  H01L2224/32225 ,  H01L2224/32145 ,  H01L2224/06102 ,  H01L2224/48148 ,  H01L2224/48158 ,  H01L2224/49112 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/73265

Abstract: A semiconductor package may include a semiconductor chip on a package substrate. The semiconductor package may include a plurality of conductive connections connecting the semiconductor chip to the package substrate may be disposed, a plurality of towers which are apart from one another and each include a plurality of memory chips may be disposed, wherein a lowermost memory chip of each of the plurality of towers overlaps the semiconductor chip from a top-down view. The semiconductor package further includes a plurality of adhesive layers be attached between the lowermost memory chip of each of the plurality of towers and the semiconductor chip.

公开(公告)号：US20220415852A1

公开(公告)日：2022-12-29

申请号：US17728118

申请日：2022-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG

IPC: H01L25/065 ,  H01L25/00

Abstract: A semiconductor package for effectively arranging devices in a limited space is provided. The semiconductor package includes: a substrate; a semiconductor chip formed on the substrate, the semiconductor chip including a center area, a first edge area, which is disposed on a first side of the center area with respect to a first directional axis, and a second edge area, which is disposed on a second side of the center area opposite the first side with respect to the first directional axis; a first spacer formed on the substrate and spaced apart from the semiconductor chip in a direction along the first directional axis; a second spacer formed on the substrate and spaced apart from the semiconductor chip in a direction along the first directional axis; a first chip stack disposed on the semiconductor chip and the first spacer; and a second chip stack disposed on the semiconductor chip and the second spacer. A lowermost chip of the first chip stack is positioned on the first edge area of the semiconductor chip, but not on the center area of the semiconductor chip, and a lowermost chip of the second chip stack is positioned on the second edge area of the semiconductor chip, but not on the center area of the semiconductor chip.

公开(公告)号：US20240250066A1

公开(公告)日：2024-07-25

申请号：US18535339

申请日：2023-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonghyun BAEK ,  Hyungu KANG ,  Cheol-Woo LEE ,  Sunghwan YOON ,  Eunjeong IM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L23/5381 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: A semiconductor package including first and second chip stacks each including semiconductor chips having an offset stack structure, the second chip stack horizontally spaced apart from the first chip stack, a first buffer chip on the substrate and at a side of the first chip stack, a second buffer chip on the substrate and at a side of the second chip stack, a connection substrate on the first and second chip stacks, a first mold layer covering the substrate, the first chip stack, and the second stack and exposing a top surface of the connection substrate, third and fourth chip stacks each including semiconductor chips having an offset stack structure on the first mold layer and, the fourth chip stack horizontally spaced apart from the third chip stack, and a second mold layer covering the first mold layer, the third chip stack, and the fourth chip stack may be provided.

公开(公告)号：US20180026662A1

公开(公告)日：2018-01-25

申请号：US15339264

申请日：2016-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Yoochang EUN

IPC: H03M13/41 ,  H03M13/39 ,  H03M13/23 ,  H04W72/04 ,  H04L1/00

CPC classification number: H03M13/413 ,  H03M13/23 ,  H03M13/3738 ,  H03M13/3961 ,  H03M13/4107 ,  H03M13/6502 ,  H03M13/658 ,  H03M13/6583 ,  H04L1/0045 ,  H04L1/0046 ,  H04L1/0052 ,  H04L1/0059 ,  H04W72/042 ,  H04W84/042

Abstract: A mobile device includes a display, a mobile-communication modem including a Viterbi decoder (VD) configured to decode a tail biting convolutional code (TBCC)-encoded data, a memory coupled to the mobile-communication modem, and a wireless antenna coupled to the mobile-communication modem and to receive a Physical Downlink Control Channel (PDCCH). The VD is configured to: receive data encoded by TBCC; select a candidate to initiate a training section; determine final path metric (PM) values of possible states at a last step of the training section; determine a PM-related value based on the final PM values of the possible states; and determine an early termination of a decoding for the candidate based on the PM-related value.

公开(公告)号：US20220130793A1

公开(公告)日：2022-04-28

申请号：US17223614

申请日：2021-04-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Jaekyu SUNG

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/18

Abstract: A semiconductor package may include a semiconductor chip on a package substrate. The semiconductor package may include a plurality of conductive connections connecting the semiconductor chip to the package substrate may be disposed, a plurality of towers which are apart from one another and each include a plurality of memory chips may be disposed, wherein a lowermost memory chip of each of the plurality of towers overlaps the semiconductor chip from a top-down view. The semiconductor package further includes a plurality of adhesive layers be attached between the lowermost memory chip of each of the plurality of towers and the semiconductor chip.

公开(公告)号：US20180013447A1

公开(公告)日：2018-01-11

申请号：US15340992

申请日：2016-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Yoochang EUN

IPC: H03M13/23 ,  H03M13/41 ,  H04L1/00

CPC classification number: H03M13/23 ,  H03M13/4107 ,  H03M13/413 ,  H03M13/4169 ,  H04L1/0045 ,  H04L1/0059

Abstract: A convolutional decoder includes a first storage, a second storage, a branch metric processor to determine branch metrics for transitions of states from a start step to a last step according to input bit streams, an ACS processor to select maximum likelihood path metrics to determine a survival path according to the branch metrics and to update states of the start step to the first storage and the second storage alternately based on the selection of the maximum likelihood path metrics, and a trace back logic to selectively trace back the survival path based on the states of the start step stored in a selected storage among the first storage and the second storage.

公开(公告)号：US20150055591A1

公开(公告)日：2015-02-26

申请号：US14467362

申请日：2014-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungu KANG ,  Seongwook SONG

IPC: H04W72/02 ,  H04W72/08 ,  H04L1/00 ,  H04L5/00

CPC classification number: H04L1/0034 ,  H04J11/004 ,  H04L1/0046 ,  H04L1/0048 ,  H04L1/0072 ,  H04L5/0053 ,  H04L5/0073

Abstract: An interference signal control information acquisition method and apparatus for use in the wireless communication system is provided. The interference signal information detection method of a terminal for use in a wireless communication system includes acquiring a first control information part and a second control information part of other users from a received signal, generating a first control information candidate identical in bit length with the first control information part, blindly decoding first control information based on the first control information candidate, and detecting and removing interference signals of the other users from the received signal based on the blindly decoded first control information.

Abstract translation: 提供了一种在无线通信系统中使用的干扰信号控制信息获取方法和装置。 用于无线通信系统的终端的干扰信号信息检测方法包括从接收信号中获取其他用户的第一控制信息部分和第二控制信息部分，生成与第一 控制信息部分，基于第一控制信息候选盲目地解码第一控制信息，并且基于盲解码的第一控制信息，从接收到的信号中检测和去除其他用户的干扰信号。