公开(公告)号：US20210257294A1

公开(公告)日：2021-08-19

申请号：US17307212

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkuk BAE ,  Hyunsoo CHUNG ,  Inyoung LEE ,  Donghyeon JANG

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/00 ,  H01L21/768

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad disposed on the semiconductor substrate, and a pillar pattern disposed on the conductive pad. The semiconductor device further includes a solder seed pattern disposed on the pillar pattern, and a solder portion disposed on the pillar pattern and the solder seed pattern. A first width of the solder seed pattern is less than a second width of a top surface of the pillar pattern.

公开(公告)号：US20230178434A1

公开(公告)日：2023-06-08

申请号：US17879049

申请日：2022-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minyoung KWON ,  Kwangwuk PARK ,  Youngmin LEE ,  Inyoung LEE ,  Sungdong CHO

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/528

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L21/76816 ,  H01L23/5283 ,  H01L21/76897

Abstract: A semiconductor device including a semiconductor substrate, an interlayer insulation layer on the semiconductor substrate, a first via structure passing through the semiconductor substrate and the interlayer insulation layer and having a first diameter, and a second via structure passing through the semiconductor substrate and the interlayer insulation layer, the second via structure having a second diameter greater than the first diameter, at a same vertical level may be provided. A sidewall of the first via structure may include at least one undercut region horizontally protruding toward a center of the first via structure, and an outer sidewall of the second via structure may be in contact with either the semiconductor substrate or the interlayer insulation layer at an area above the undercut region.

公开(公告)号：US20200260051A1

公开(公告)日：2020-08-13

申请号：US16697738

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjoo SHIN ,  Sohyeon KIM ,  Inyoung LEE ,  Yuri SIN ,  Jiwoo LEE ,  Jaebong CHUN

IPC: H04N7/18 ,  H01Q21/06 ,  H04N5/225

Abstract: Various embodiments relate to an electronic device that supports millimeter wave communication. The electronic device may include: a housing; an antenna structure including at least one antenna comprising a portion of the housing or positioned in the housing, and including an annular conductive structure comprising a conductive material, the annular conductive structure having a first surface facing an outside of the housing, a second surface facing a direction opposite the first surface, an internal space defined by the first surface and the second surface, and a plurality of slots having a repeating pattern and formed through the first surface to the internal space; a conductive member comprising a conductive material disposed in the internal space; a wireless communication circuit electrically connected with the conductive member and configured to form a directional beam using the antenna structure; and a ground electrically connected to the annular conductive structure.

公开(公告)号：US20240322421A1

公开(公告)日：2024-09-26

申请号：US18678487

申请日：2024-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donguk CHOI ,  Yongjoo SHIN ,  Jeonghoon KIM ,  Yoseb OH ,  Jaebong CHUN ,  Inyoung LEE

IPC: H01Q1/27 ,  H01Q1/38 ,  H01Q7/00

CPC classification number: H01Q1/273 ,  H01Q1/38 ,  H01Q7/00

Abstract: According to various embodiments, a wearable electronic device includes: a housing, a first conductive pattern disposed in an internal space of the housing, at least one second conductive pattern disposed within a specified distance of the first conductive pattern, a wireless communication circuit disposed in the internal space and configured to transmit and/or receive a radio signal in a designated frequency band through the first conductive pattern, and a touch sensor module disposed in the internal space and configured to detect a touch on the housing through the first conductive pattern. The second conductive pattern may be disposed at a position capable of being capacitively coupled with the first conductive pattern upon the touch.

公开(公告)号：US20190139785A1

公开(公告)日：2019-05-09

申请号：US16234815

申请日：2018-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chanho LEE ,  Hyunsoo CHUNG ,  Hansung RYU ,  Inyoung LEE

IPC: H01L21/50 ,  H01L23/00 ,  H01L23/544 ,  H01L21/02 ,  H01L25/065 ,  H01L23/48 ,  H01L23/373 ,  H01L23/58 ,  H01L21/48 ,  H01L23/31

Abstract: A semiconductor device including a substrate, an insulating layer on the substrate and including a trench, at least one via structure penetrating the substrate and protruding above a bottom surface of the trench, and a conductive structure surrounding the at least one via structure in the trench may be provided.

公开(公告)号：US20240056116A1

公开(公告)日：2024-02-15

申请号：US18485826

申请日：2023-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woosuk KANG ,  Sewoong KIM ,  Jeonghoon KIM ,  Kyuho LEE ,  Donguk CHOI ,  Inyoung LEE ,  Jinwoo JUNG ,  Jaebong CHUN

IPC: H04B1/3827 ,  H04R1/06 ,  H04R1/10

CPC classification number: H04B1/385 ,  H04R1/06 ,  H04R1/1075 ,  H04R1/1041 ,  H04B2001/3872 ,  H01Q1/273

Abstract: A wearable electronic device is provided. The wearable electronic device includes a housing, a conductive patch, a printed circuit board (PCB) disposed in the housing, a wireless communication circuit disposed on the PCB and a first touch sensing circuit, wherein the housing may comprise a first housing facing away from the body wearing the electronic device, and a second housing facing toward the body. The wireless communication circuit supplies power to a first point spaced apart from an edge of the conductive patch by a specific distance or more and receive a radio frequency (RF) signal of a first frequency band, and the first touch sensing circuit senses a touch input with respect to the conductive patch.

公开(公告)号：US20220139806A1

公开(公告)日：2022-05-05

申请号：US17371602

申请日：2021-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangwuk PARK ,  Youngmin LEE ,  Hyoungyol MUN ,  Inyoung LEE ,  Seokhwan JEONG ,  Sungdong CHO

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/528 ,  H01L21/768

Abstract: A semiconductor device, includes: a substrate having a first surface on which a plurality of devices are disposed and a second surface, opposite to the first surface; an interlayer insulating film on the first surface of the substrate; an etching delay layer disposed in a region between the substrate and the interlayer insulating film; first and second landing pads on the interlayer insulating film; a first through electrode penetrating through the substrate and the interlayer insulating film; and a second through electrode penetrating the substrate, the etching delay layer, and the interlayer insulating film, the second through electrode having a width, greater than that of the first through electrode, wherein each of the first and second through electrodes includes first and second tapered end portions in the interlayer insulating film, each of first and second tapered end portions having a cross-sectional shape narrowing closer to the landing pads.

公开(公告)号：US20210226326A1

公开(公告)日：2021-07-22

申请号：US16972111

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sewoong KIM ,  Chaeup YOO ,  Sumin YUN ,  Woosuk KANG ,  Inyoung LEE

IPC: H01Q1/38 ,  H05K5/00 ,  H05K7/14 ,  H05K1/02 ,  H01Q1/24

Abstract: According to an embodiment, an electronic device may include a display including a first conductive plate, a printed circuit board interposed between a rear surface of housing and the display and including a second conductive plate, a first conductive pattern and a second conductive pattern that are interposed between the display and the printed circuit board, a wireless communication circuit electrically connected to the first conductive pattern and transmitting or receiving an RF signal of a first frequency or an RF signal of a second frequency, and at least one processor electrically connected to the wireless communication circuit. Besides, various embodiments as understood from the specification are also possible.

公开(公告)号：US20230044131A1

公开(公告)日：2023-02-09

申请号：US17671818

申请日：2022-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangwuk PARK ,  Youngmin LEE ,  Inyoung LEE ,  Sungdong CHO

IPC: H01L23/58 ,  H01L25/065 ,  H01L23/522

Abstract: A semiconductor chip, a semiconductor package including the same, and a method of fabricating the same, the semiconductor chip including a substrate that includes a device region and an edge region; a device layer and a wiring layer that are sequentially stacked on the substrate; a subsidiary pattern on the wiring layer on the edge region; a first capping layer that covers a sidewall of the subsidiary pattern, a top surface of the wiring layer, and a sidewall of the wiring layer, the first capping layer including an upper outer sidewall and a lower outer sidewall, the lower outer sidewall being offset from the upper outer sidewall; and a buried dielectric pattern in contact with the lower outer sidewall of the first capping layer and spaced apart from the upper outer sidewall of the first capping layer.

公开(公告)号：US20230005853A1

公开(公告)日：2023-01-05

申请号：US17674974

申请日：2022-02-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kunsang PARK ,  Kyuha LEE ,  Youngmin LEE ,  Seokho KIM ,  Inyoung LEE ,  Seokhwan JEONG ,  Sungdong CHO

IPC: H01L23/00 ,  H01L25/065 ,  H01L21/66

Abstract: A semiconductor package includes a first structure having a first insulating layer and a first bonding pad penetrating the first insulating layer, and a second structure on the first structure and having a second insulating layer bonded to the first insulating layer, a bonding pad structure penetrating the second insulating layer and bonded to the first bonding pad, and a test pad structure penetrating the second insulating layer and including a test pad in an opening penetrating the second insulating layer and having a protrusion with a flat surface, and a bonding layer filling the opening and covering the test pad and the flat surface, the protrusion of the test pad extending from a surface in contact with the bonding layer, and the flat surface of the protrusion being within the opening and spaced apart from an interface between the bonding layer and the first insulating layer.