公开(公告)号：US20190109010A1

公开(公告)日：2019-04-11

申请号：US16058981

申请日：2018-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNWOO LEE ,  SANGROK OH ,  JUNGMO SUNG ,  JONGWOO SUN

IPC: H01L21/308

Abstract: A method of forming patterns of a semiconductor device includes forming a photoresist pattern, which contains a first carbon compound, on a substrate, reforming a top surface of the photoresist pattern to form an upper mask layer which contains a second carbon compound, different from the first carbon compound, on the photoresist pattern, and etching a portion of the substrate using the upper mask layer and the photoresist pattern as an etch mask.

公开(公告)号：US20220199374A1

公开(公告)日：2022-06-23

申请号：US17372131

申请日：2021-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEJIN OH ,  TAEMIN EARMME ,  EUNWOO LEE ,  JONGWOO SUN

IPC: H01J37/32 ,  H01J37/244 ,  H01L21/66

Abstract: A method of monitoring a substrate processing apparatus includes applying a high-frequency radio frequency (RF) power signal and a low-frequency RF power signal from a bias power supply apparatus to an electrostatic chuck of a process chamber through a matching circuit. The method further includes applying a direct current (DC) power signal from a DC power supply apparatus to an edge ring of the process chamber through a high-frequency filter and a low-frequency filter. The method further includes measuring a low-frequency RF voltage value at a first point between the matching circuit and the electrostatic chuck, measuring the low-frequency RF voltage value at a second point between the high-frequency filter and the low-frequency filter, and acquiring a voltage ratio between the low-frequency RF voltage value at the first point and the low-frequency RF voltage value at the second point. The method further includes monitoring a state of the edge ring by comparing a threshold with the voltage ratio.

公开(公告)号：US20220189746A1

公开(公告)日：2022-06-16

申请号：US17373214

申请日：2021-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONGIL MUN ,  JINYOUNG PARK ,  JONGWOO SUN ,  HYUNGJOO LEE

IPC: H01J37/32 ,  H01L21/683

Abstract: Semiconductor processing equipment and an electrostatic chuck include a semiconductor having: an upper electrode; a gas supplier connected to the upper electrode; and a substrate supporting structure spaced apart from the upper electrode to define a processing volume. The substrate supporting structure supports a substrate and includes: a lower electrode having a side area disposed outside a step formed at an outer perimeter portion of the lower electrode and a processing area disposed inside the step; a first plate disposed on the lower electrode; an attraction electrode disposed on the first plate; and a second plate disposed on the attraction plate. The second plate supports the substrate in a state in which the substrate is laid on an upper surface of the second plate. Each of the first plate and the second plate includes ceramic. The lower electrode has a maximum height at a central portion of the processing area.

公开(公告)号：US20210142985A1

公开(公告)日：2021-05-13

申请号：US16915437

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： AKIRA KOSHIISHI ,  MASATO HORIGUCHI ,  YONGWOO LEE ,  KYOHYEOK KIM ,  DOWON KIM ,  YUNHWAN KIM ,  YOUNGJIN NOH ,  JONGWOO SUN ,  TAEIL CHO

IPC: H01J37/32 ,  H01L21/683

Abstract: A plasma processing apparatus includes a chamber, a lower and upper electrodes vertically spaced apart from each other in the chamber, a RF transmitting part connected to the lower electrode and configured to supply RF power to the lower electrode, a ground plate spaced downwardly from the lower electrode, and an insulating member laterally surrounding a cavity formed between the lower electrode and the ground plate. The cavity is isolated from a region under the ground plate by the ground plate.

公开(公告)号：US20200168443A1

公开(公告)日：2020-05-28

申请号：US16445423

申请日：2019-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEJIN OH ,  KYOHYEOK KIM ,  JONGWOO SUN ,  DOUGYONG SUNG ,  SUNG-KI LEE ,  JAEHYUN LEE

IPC: H01J37/32 ,  H01J37/22 ,  G01N21/94 ,  H01L21/66 ,  H01L21/3065

Abstract: A substrate processing method includes providing a substrate into a process chamber; introducing a reference light into the process chamber; generating a plasma light in the process chamber while performing an etching process on the substrate; receiving the reference light and the plasma light; and detecting an etching end point by analyzing the plasma light and the reference light. Detecting the etching end point includes a compensation adjustment based on a change rate of an absorption signal of the reference light with respect to a change rate of an emission signal of the plasma light