Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, a buried layer a second conductivity type different from the first conductivity type on the substrate and an epitaxial layer of the second conductivity type on the buried layer. The device further includes a pocket well of the first conductivity type in the epitaxial layer, a first drift region in the epitaxial layer at least partially overlapping the pocket well, a second drift region in the epitaxial layer and spaced apart from the first drift region, and a body region of the first conductivity type in the pocket well. A gate electrode is disposed on the body region, the pocket well and the first drift region and has an edge overlying the epitaxial region between the first and second drift regions.
Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, a buried layer a second conductivity type different from the first conductivity type on the substrate and an epitaxial layer of the second conductivity type on the buried layer. The device further includes a pocket well of the first conductivity type in the epitaxial layer, a first drift region in the epitaxial layer at least partially overlapping the pocket well, a second drift region in the epitaxial layer and spaced apart from the first drift region, and a body region of the first conductivity type in the pocket well. A gate electrode is disposed on the body region, the pocket well and the first drift region and has an edge overlying the epitaxial region between the first and second drift regions.
Abstract:
Semiconductor devices are provided including a substrate having a first conductivity type; a source region having a second conductivity type, different from the first conductivity type; a drain region, separate from the source region and having the second conductivity type; a body region having the first conductivity type and on the substrate surrounding side and bottom surfaces of the source region; a drift region having the second conductivity type, the drift region being on the substrate surrounding side and bottom surfaces of the drain region; a first gate on the body region; and an electrically floating second gate, separate from the first gate, on the drift region.
Abstract:
A semiconductor device having a wide depletion region for increasing the breakdown voltage of the device includes an epitaxial layer of a first conductive type. An anode electrode and a cathode electrode are arranged on the epitaxial layer to be separated from each other. A first drift layer of the first conductive type formed in the epitaxial layer. A Schottky contact area is at a region of contact between the anode electrode and the first drift layer. An impurity region of a second conductive type is different from the first conductive type at the epitaxial layer. An insular impurity region is formed below the Schottky contact area.
Abstract:
A semiconductor device may include a semiconductor substrate, a first conductive type well and a second conductive type drift region in the semiconductor substrate, the drift region including a first drift doping region and a second drift doping region, the second drift doping region vertically overlapping the well, and a first conductive type body region in the well, the body region being in contact with a side of the first drift doping region. The first drift doping region and the second doping region may include a first conductive type dopant and a second conductive type dopant, and an average density of the first conductive type dopant in the first drift doping region may be less than an average density of the first conductive type dopant in the second drift doping region.
Abstract:
A semiconductor device includes a gate pattern over source and drain regions. The gate pattern includes a first gate adjacent the source region and a second gate adjacent the drain region. A concentration of dopants in the first gate is higher than a concentration of dopants in the second gate. As a result, channels are produced between the source and drain regions based on different threshold voltages.