公开(公告)号：US20240321557A1

公开(公告)日：2024-09-26

申请号：US18679784

申请日：2024-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jiye KIM ,  In Cheol Cheol SONG ,  Woongpil JEON ,  Daihong KIM ,  Jaebeom PARK ,  Byungho CHUN

IPC: H01J37/32 ,  C23C16/505 ,  H05K9/00

CPC classification number: H01J37/32449 ,  C23C16/505 ,  H01J37/32082 ,  H05K9/0081 ,  H01J2237/3321

Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.

公开(公告)号：US20230216941A1

公开(公告)日：2023-07-06

申请号：US18119937

申请日：2023-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaebeom PARK

IPC: H04M1/02 ,  F16C11/04

CPC classification number: H04M1/0214 ,  F16C11/045

Abstract: According to certain embodiments, a foldable electronic device comprises: a first housing; a second housing; a hinge structure coupling the first housing and the second housing; and a flexible display, wherein at least a first portion of the flexible display is disposed on the first housing and a second portion of the flexible display is disposed on the second housing, wherein the hinge structure includes: a fixing member, a first rotary member coupled to the fixing member; a second rotary member coupled to the fixing member; a first rotary shaft, wherein one end of the first rotary shaft is held on one side of the fixing member; a second rotary shaft, wherein one end of the second rotary shaft is held on an opposite side of the fixing member; a first arm part coupled to the first rotary member, with the first rotary shaft is inserted therein; a first cam structure disposed is in the first arm part; a second arm part coupled to the second rotary member with the second rotary shaft inserted therein, a second cam structure disposed in the second arm part; and a first cam member including a first cam, with the first rotary shaft inserted in the first cam, and engaged with the first cam structure, a second cam, with the second rotary shaft inserted in the second cam, and engaged with the second cam structure, and a cam body connecting the first cam and the second cam.

公开(公告)号：US20220157566A1

公开(公告)日：2022-05-19

申请号：US17356998

申请日：2021-06-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiye KIM ,  In Cheol SONG ,  Woongpil JEON ,  Daihong KIM ,  Jaebeom PARK ,  Byungho CHUN

IPC: H01J37/32 ,  H05K9/00 ,  C23C16/505

Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.

公开(公告)号：US20180051375A1

公开(公告)日：2018-02-22

申请号：US15469212

申请日：2017-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjong KIM ,  Seonggil PARK ,  Jaebeom PARK ,  Jung-soo YOON ,  Keeyoung JUN ,  Choongrae CHO ,  Jongwon HONG

IPC: C23C16/50 ,  C23C16/04 ,  C23C16/455 ,  C23C16/458 ,  C23C16/52 ,  H01J37/32

CPC classification number: C23C16/50 ,  C23C16/04 ,  C23C16/45565 ,  C23C16/4586 ,  C23C16/52 ,  H01J37/32366 ,  H01J37/3244 ,  H01J37/3255 ,  H01J37/32715 ,  H01J37/32724

Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus comprises a process chamber providing an inner space where a substrate is treated, a support unit disposed in the inner space and supporting the substrate, and a gas supply unit providing the inner space with a process gas required for generating plasma. The support unit comprises a base having a top surface on which the substrate is placed, a heater disposed in the base, and a coating layer formed on the top surface of the base.