公开(公告)号：US20140242753A1

公开(公告)日：2014-08-28

申请号：US14108961

申请日：2013-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Min YEO ,  Seung Min RYU ,  Dae Jung KIM ,  Ji Ho UH ,  Suk Won LEE

IPC: H01L23/00 ,  B23K3/08 ,  H01L21/67

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/7501 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81815 ,  H05K3/3489 ,  H05K2203/0108 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Abstract translation: 可以提供倒装芯片封装方法和用于倒装芯片封装方法的磁头制造方法。 特别地，一种倒装芯片封装方法，包括在印刷电路板（PCB）的焊盘上印刷焊剂，以倒装芯片方式将裸片安装在PCB上，使得裸片的凸块面对PCB的焊盘， 可以提供使用焊剂将管芯的焊盘凸起到PCB的焊盘。

公开(公告)号：US20240279003A1

公开(公告)日：2024-08-22

申请号：US18371707

申请日：2023-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Joo JEON ,  Jin Hyuk CHOI ,  Kyu Sang LEE ,  Myung Ki SONG ,  Ji Ho UH ,  Kong Woo LEE ,  Hyun Soo CHUN ,  Beom Soo HWANG

IPC: B65G47/90

CPC classification number: B65G47/90

Abstract: A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.

公开(公告)号：US20240278437A1

公开(公告)日：2024-08-22

申请号：US18413491

申请日：2024-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon Dong SONG ,  Jun Young MOON ,  Sang Woo PARK ,  Un Ki JEONG ,  Ji Ho UH ,  Hyun Soo CHUN

IPC: B25J13/08 ,  B25J9/02 ,  B25J9/16 ,  B25J11/00

CPC classification number: B25J13/089 ,  B25J9/02 ,  B25J9/1682 ,  B25J11/0095

Abstract: A substrate processing apparatus includes a body which includes an upper face and side faces, and extends in a first direction, a plurality of robot arms which are installed on the upper face of the body, extend in the first direction, are spaced apart from each other in a second direction perpendicular to the upper face of the body, and are able to grip a wafer, and an alignment jig (JIG) which is installed on the upper face and side faces of the body, and senses positions of the plurality of robot arms, wherein the alignment jig includes, a horizontal frame disposed on the upper face of the body, a vertical frame disposed on the side faces of the body, and a displacement sensor installed on the horizontal frame and the vertical frame to sense coordinates of upper faces of the plurality of robot arms and side faces of the plurality of robot arms, the displacement sensor includes a first sensor and a second sensor which are spaced apart from side faces of the plurality of robot arms in a third direction perpendicular to the first and second directions and spaced apart from each other in the first direction, and an upper face of the displacement sensor is disposed at a vertical level higher than vertical levels of the upper faces of each of the plurality of robot arms.