公开(公告)号：US09684333B2

公开(公告)日：2017-06-20

申请号：US14947396

申请日：2015-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Soo Han ,  Sang-In Baek ,  Jin-Hyuk Choi ,  Young-Oh Kim ,  Jae-Woo Lee ,  Jee-Young Jung

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  A45C11/00

CPC classification number: G06F1/1613 ,  A45C11/00 ,  A45C2011/002 ,  G06F1/1626 ,  G06F1/203 ,  G06F2200/1633

Abstract: An electronic device is provided. The electronic device includes a first flexible member, a rigid member positioned on one surface of the first flexible member, and a second flexible member positioned on the one surface of the first flexible member in at least a part of a periphery of the rigid member. The first flexible member is attached to a case member of the electronic device with the rigid member and the second flexible member being interposed therebetween.

公开(公告)号：US09872092B2

公开(公告)日：2018-01-16

申请号：US14594236

申请日：2015-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Eun Han ,  Ki-Won Kim ,  Myung-Cheol Lee ,  Sun-Young Lee ,  Young-Bae Ji ,  Jin-Hyuk Choi

IPC: H04R1/02 ,  H04R1/28

CPC classification number: H04R1/023 ,  H04R1/2811

Abstract: A speaker device and an electronic device including the speaker device. The speaker device includes a speaker body, which includes a front surface, a rear surface, and a side surface provided between the front surface and the rear surface, and a sealing member provided to enclose at least the side surface of the speaker body, in which the sealing member isolates sound output through the front surface of the speaker body and sound output through the rear surface of the speaker body from each other. The speaker device and the electronic device including the same may be implemented variously according to an embodiment.

公开(公告)号：US10355429B2

公开(公告)日：2019-07-16

申请号：US15657006

申请日：2017-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  HYUPJINCONNECTOR CO., LTD.

Inventor： Myeong-Hwa Kim ,  Yang-Jean Park ,  Yeon-Kwan Moon ,  Jin-Woo Park ,  Myung-Suk Bae ,  Jung-Hyun Cho ,  Jin-Hyuk Choi ,  Jae-Ryong Han ,  Jang-Won Hur

IPC: H01R13/73 ,  H01R13/74 ,  H01R12/71 ,  H01R13/24

Abstract: A connection terminal device and an electronic device having the same are provided. The connection terminal device includes a connection terminal device body, and a connection terminal connected to the connection terminal device body. The connection terminal device also has a front unit disposed on a front surface of the connection terminal device body, a rear unit disposed on a rear surface of the connection terminal device body, and a support disposed on the rear surface of the connection terminal device body. When force is applied to the connection terminal, supporting force is transferred to the rear unit of the connection terminal device body.

公开(公告)号：US10219397B2

公开(公告)日：2019-02-26

申请号：US15095362

申请日：2016-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Hyuk Choi ,  Jae-Woo Lee ,  Jee-Young Jung ,  Jong-Chul Choi

IPC: H01R12/77 ,  H05K5/03 ,  H05K1/02 ,  G06F1/16 ,  H04M1/02 ,  H05K1/14

Abstract: An electronic device includes a first main body part at least one second main body part connected to the first main body part so as to be rotatable, or such that the first and second main body parts pivot relative to each other, and a connecting part that connects the second main body part to the first main body part or another second main body part adjacent thereto, wherein the connecting part includes a connecting member that rotatably connects the first and at least one second main body parts, a flexible printed circuit board (FPCB) that is surrounded by the connecting member and electrically connects at least one second main body part to the first main body part and a reinforcing member that is interposed between the connecting member and the FPCB and at least partially overlaps the FPCB.

公开(公告)号：US20150284847A1

公开(公告)日：2015-10-08

申请号：US14520768

申请日：2014-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Ki Hong ,  Young-Min Park ,  Hyoung-Won Oh ,  Jin-Hyuk Choi ,  Sang-Chul Han

IPC: C23C16/455 ,  C23C16/511 ,  H01L21/02

CPC classification number: C23C16/45519 ,  C23C16/24 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/511 ,  C30B25/165 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/0262

Abstract: In a method of forming an epitaxial layer, a first plasma may be generated from a first reaction gas in a first region. The first plasma may be applied to a second reaction gas provided to a second region isolated from the first region to generate a second plasma from the second reaction gas. A blocking gas may be injected into the second region toward an edge of the substrate to help prevent the first plasma and the second plasma from being horizontally diffused. The first plasma and the second plasma may be applied to the substrate to form the epitaxial layer. Thus, the epitaxial layer may be formed at a temperature relatively lower than a temperature in a heating process.

Abstract translation: 在形成外延层的方法中，可以从第一区域中的第一反应气体产生第一等离子体。 可以将第一等离子体施加到提供给从第一区域分离的第二区域的第二反应气体，以从第二反应气体产生第二等离子体。 阻挡气体可以朝向基板的边缘注入第二区域，以帮助防止第一等离子体和第二等离子体水平扩散。 可以将第一等离子体和第二等离子体施加到衬底以形成外延层。 因此，可以在相对低于加热过程中的温度的温度下形成外延层。