公开(公告)号：US20160133586A1

公开(公告)日：2016-05-12

申请号：US14789247

申请日：2015-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-hyun CHO ,  Jun-phyo LEE ,  Yong-hwan JEONG

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05576 ,  H01L2224/05616 ,  H01L2224/0562 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0603 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/48229 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00012

Abstract: A semiconductor device includes a main pad part and a sub pad part formed in a peripheral area of at least one side of the main pad part. The sub pad part is spaced apart from the main pad part. The sub pad part operates in a first state in which the sub pad part is short-circuited with the main pad part or in a second state in which the sub pad part is open from the main pad part.

Abstract translation: 半导体器件包括形成在主焊盘部分的至少一侧的周边区域中的主焊盘部分和子焊盘部分。 辅助焊盘部分与主焊盘部分间隔开。 辅助焊盘部分工作在第一状态，其中子焊盘部分与主焊盘部分短路或者在其中子焊盘部分从主焊盘部分打开的第二状态。