ELECTRONIC DEVICE INCLUDING REAR PLATE AND METHOD FOR FORMING THE SAME

    公开(公告)号:US20230030545A1

    公开(公告)日:2023-02-02

    申请号:US17845041

    申请日:2022-06-21

    Abstract: An electronic device, rear plate, and method of forming the rear plate are disclosed. The electronic device includes a housing including a front plate, the rear plate facing an opposite direction to the front plate, and a side structure surrounding a space formed between the front plate and the rear plate, and a display. The rear plate includes a glass plate and decorative member, the decorative member including a first base plate, a second base plate, a first molding pattern disposed on the first base plate and including a 3-dimensional pattern, a first adhesive layer between the first molding pattern layer and the second base plate, wherein an index of refraction of the first adhesive layer is different from an index of refraction of the first molding pattern, and a shielding printing layer.

    ORNAMENTAL MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20230031125A1

    公开(公告)日:2023-02-02

    申请号:US17709837

    申请日:2022-03-31

    Abstract: An electronic device and ornamental member for the same are disclosed herein. The electronic devices includes a housing, a front plate disposed on one surface of the housing, and a rear plate disposed on a rear surface of the housing, wherein one of the plates includes the ornamental member, which includes: a base film attached to one surface of a transparent plate and configured to at least partially transmit light, an ultra-violet (UV) molding layer formed on a surface of the base film, and a plurality of refractive layers sequentially stacked on a surface of the UV molding layer, wherein at least one of the plurality of refractive layers is formed to have a different refractive index and a different surface area from a remainder of the refractive layers.

    SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA

    公开(公告)号:US20250014871A1

    公开(公告)日:2025-01-09

    申请号:US18406898

    申请日:2024-01-08

    Abstract: According to an aspect of the present inventive concepts, a semiconductor processing apparatus includes: a chamber; an electrostatic chuck in an internal space of the chamber; a plurality of grid electrodes installed on the electrostatic chuck so as to be separated from each other in a first direction, perpendicular to an upper surface of the electrostatic chuck, and respectively having a plurality of through-holes; a plurality of reflectors between the plurality of grid electrodes and the electrostatic chuck and reflecting ions passing through the plurality of through-holes in each of the plurality of grid electrodes; and a voltage supply unit outputting a bias voltage having a predetermined cycle to at least one of the plurality of grid electrodes, wherein each of the plurality of grid electrodes includes a base plate containing a conductive material, and a cover layer covering a surface of the base plate and containing a metal oxide.

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