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    MEASURING APPARATUS AND TESTING APPARATUS HAVING THE SAME
    2.
    发明公开
    MEASURING APPARATUS AND TESTING APPARATUS HAVING THE SAME 审中-公开

    公开(公告)号：US20240183777A1

    公开(公告)日：2024-06-06

    申请号：US18334789

    申请日：2023-06-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yasuhiro HIDAKA ,  Ingi KIM

    IPC: G01N21/3581

    CPC classification number: G01N21/3581 ,  G01N2201/06113

    Abstract: A measuring apparatus includes a first beam splitter, a diffraction grating, an optical illumination system, an optical condensing system configured to condense an electromagnetic wave EH radiated from the specimen, a time domain detector configured to detect the electromagnetic wave EH, for each time when the trigger beam, light path length of which has been changed in a delay mechanism, is incident, and a controller configured to lock-in detect the electromagnetic wave EH with a driving frequency of an amplitude modulation element, wherein the controller obtains a magnitude and a direction of an electric field of the measurement portion by Fourier transforming a time domain waveform of the detected electromagnetic wave EH to obtain a frequency domain waveform, and filtering a frequency band from the obtained frequency domain waveform.

    SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA
    3.
    发明申请
    SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA 有权

    公开(公告)号：US20250014871A1

    公开(公告)日：2025-01-09

    申请号：US18406898

    申请日：2024-01-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sungwon CHO ,  Kyunghyun KIM ,  Ingi KIM ,  Sangki NAM ,  Dougyong SUNG ,  Sejin OH ,  Sungho JANG

    IPC: H01J37/32 ,  H01L21/683

    Abstract: According to an aspect of the present inventive concepts, a semiconductor processing apparatus includes: a chamber; an electrostatic chuck in an internal space of the chamber; a plurality of grid electrodes installed on the electrostatic chuck so as to be separated from each other in a first direction, perpendicular to an upper surface of the electrostatic chuck, and respectively having a plurality of through-holes; a plurality of reflectors between the plurality of grid electrodes and the electrostatic chuck and reflecting ions passing through the plurality of through-holes in each of the plurality of grid electrodes; and a voltage supply unit outputting a bias voltage having a predetermined cycle to at least one of the plurality of grid electrodes, wherein each of the plurality of grid electrodes includes a base plate containing a conductive material, and a cover layer covering a surface of the base plate and containing a metal oxide.

    ELECTRONIC DEVICE INCLUDING FOLDABLE CONDUCTIVE PLATE
    5.
    发明申请
    ELECTRONIC DEVICE INCLUDING FOLDABLE CONDUCTIVE PLATE 有权

    公开(公告)号：US20210029841A1

    公开(公告)日：2021-01-28

    申请号：US16932040

    申请日：2020-07-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Wooktae KIM ,  Gyuha JO ,  Ingi KIM

    IPC: H05K5/02 ,  H05K5/00

    Abstract: An electronic device is provided. The electronic device includes a hinge, a first housing connected to the hinge, a second housing connected to the hinge so as to fold the first housing, and a display disposed to receive support of at least a portion of the second housing from at least a portion of the first housing through the hinge. The display includes a display panel, at least one polymer member disposed at a rear surface of the display panel, and a conductive plate disposed at a rear surface of the at least one polymer member. The conductive plate includes a first flat portion facing the first housing, a second flat portion facing the second housing, and a flexible portion configured to connect the first flat portion and the second flat portion and disposed to be bendable. The flexible portion includes support pieces spaced apart from each other through slits, and a conductive elastic member configured to connect electrically and physically the first flat portion, the support pieces, and the second flat portion.

    SUBSTRATE TREATING APPARATUS AND METHOD OF TREATING SUBSTRATE
    8.
    发明申请
    SUBSTRATE TREATING APPARATUS AND METHOD OF TREATING SUBSTRATE 有权
    基板处理装置和处理基板的方法

    公开(公告)号：US20170062287A1

    公开(公告)日：2017-03-02

    申请号：US15175062

    申请日：2016-06-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyoung Hwan KIM ,  Ingi KIM ,  Mihyun PARK ,  Young-Hoo KIM ,  Ui-soon PARK ,  Jung-Min OH ,  Kuntack LEE ,  Hyosan LEE

    IPC: H01L21/66 ,  H01L21/306

    CPC classification number: H01L21/31111 ,  H01L21/67086 ,  H01L21/67253 ,  H01L21/67288

    Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.

    Abstract translation: 一种基板处理装置及其处理方法，其特征在于，具备使用化学溶液处理基板的基板处理装置，所述化学溶液含有磷酸水溶液和硅化合物; 以及向所述基板处理单元供给所述化学溶液的化学溶液供给体，所述化学溶液供给体包含测定所述化学溶液浓度的浓度测定器，所述浓度测定器包括测定所述化学溶液的水浓度的第一浓度测定器 ; 以及测量化学溶液的硅浓度的第二浓度测量器。

    INSPECTION DEVICE
    10.
    发明申请
    INSPECTION DEVICE 有权

    公开(公告)号：US20230125628A1

    公开(公告)日：2023-04-27

    申请号：US18047820

    申请日：2022-10-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Shinji UEYAMA ,  Ingi KIM ,  Harutaka SEKIYA ,  Tomoki ONISHI

    IPC: G11C11/16 ,  G01R33/12

    Abstract: To reduce a measurement time, an inspection device includes a stage configured to fix a magnetoresistive random access memory (MRAM) to a stage surface and moving the MRAM, a plurality of magnets configured to generate a gradient magnetic, a plurality of line sensors comprising a first line sensor for detecting a magneto-optical effect at a first location of the MRAM and a second line sensor for detecting the magneto-optical effect at a second location that is different from the first location by moving a location of the MRAM within the gradient magnetic field, and an information processor configured to process the magneto-optical effect detected by the plurality of line sensors. Thus, throughput may be improved.

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