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1.发明授权公开(公告)号：US10923465B2
公开(公告)日：2021-02-16
申请号：US16417934
申请日：2019-05-21
发明人： Won-Gi Chang , Dongwon Lee , Myung-Sung Kang , Hyein Yoo
IPC分类号： H01L25/00 , H01L21/683 , H01L21/56 , H01L23/31 , H01L23/00 , H01L21/78 , H01L25/065
摘要： A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.
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公开(公告)号：US10910339B2
公开(公告)日：2021-02-02
申请号：US16533450
申请日：2019-08-06
发明人： Hwail Jin , Yongwon Choi , Myung-Sung Kang , Yeongseok Kim , Wonkeun Kim
摘要： A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.
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3.发明授权公开(公告)号：US10354985B2
公开(公告)日：2019-07-16
申请号：US15438184
申请日：2017-02-21
发明人： Won-Gi Chang , Dongwon Lee , Myung-Sung Kang , Hyein Yoo
IPC分类号： H01L21/56 , H01L25/00 , H01L21/78 , H01L23/00 , H01L25/065
摘要： A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.
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4.发明授权公开(公告)号：US11355413B2
公开(公告)日：2022-06-07
申请号：US16540495
申请日：2019-08-14
发明人： Joungphil Lee , Myung-Sung Kang , Yeongseok Kim , Gwangsun Seo , Hyein Yoo , Yongwon Choi
IPC分类号： C09J7/28 , C09J11/04 , H01L23/373 , H01L23/29 , H01L23/00 , H01L23/31 , H01L23/538 , H01L23/367
摘要： An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.
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公开(公告)号：US08958011B2
公开(公告)日：2015-02-17
申请号：US13828618
申请日：2013-03-14
发明人： Sang-Sick Park , Myung-Sung Kang , Ji-Seok Hong
IPC分类号： H04N5/225 , H04N5/232 , G03B13/00 , H04N9/04 , H01J7/24 , H01J40/14 , H01L31/0232 , H01L31/0203 , H01L21/00 , H01L31/00 , H01L27/146
CPC分类号： H04N5/2251 , H01L27/14618 , H01L27/14625 , H01L2924/0002 , H04N5/2257 , Y10T29/53178 , H01L2924/00
摘要： Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.
摘要翻译： 提供了包括其的双向相机模块和倒装芯片接合器。 模块包括分别安装有上传感器和下传感器的电路板，分别设置在上传感器和下传感器下的上透镜和下透镜，以及固定上透镜和下透镜间隔开的壳体 分别是上传感器和下传感器。 外壳围绕电路板。 壳体具有多个入口和空气流过的出口，并且壳体具有通过下透镜和下传感器之间的空间从入口连接到出口的空气通道。
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6.发明申请公开(公告)号：US20190273075A1
公开(公告)日：2019-09-05
申请号：US16417934
申请日：2019-05-21
发明人： Won-Gi Chang , Dongwon Lee , Myung-Sung Kang , Hyein Yoo
IPC分类号： H01L25/00 , H01L25/065 , H01L23/00 , H01L21/78 , H01L21/56
摘要： A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.
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