公开(公告)号：US10433469B1

公开(公告)日：2019-10-01

申请号：US16131596

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil Lee

IPC: H01L23/552 ,  H05K9/00 ,  H01L23/31 ,  B32B17/06 ,  B32B15/04 ,  B32B7/12

Abstract: A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

公开(公告)号：US11355413B2

公开(公告)日：2022-06-07

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Myung-Sung Kang ,  Yeongseok Kim ,  Gwangsun Seo ,  Hyein Yoo ,  Yongwon Choi

IPC: C09J7/28 ,  C09J11/04 ,  H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/367

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US11876031B2

公开(公告)日：2024-01-16

申请号：US17376600

申请日：2021-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Wonkeun Kim ,  Mihyae Park

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065 ,  H01L25/10 ,  H01L23/367

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor package includes at least one semiconductor device mounted on a first substrate, a thermosetting resin layer on the at least one semiconductor device, the thermosetting resin layer including an irreversible thermochromic pigment, a metal plate on the thermosetting resin layer, and a molding member surrounding the at least one semiconductor device at least in a lateral direction and being in contact with the thermosetting resin layer.

公开(公告)号：US12062633B2

公开(公告)日：2024-08-13

申请号：US17551387

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/00 ,  C08K3/013 ,  C08K5/00 ,  C08L63/00 ,  H01L21/66 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/29 ,  C08K3/013 ,  C08K5/0041 ,  C08L63/00 ,  H01L22/30 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0652 ,  H01L2224/16147 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/27515 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33055 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06589 ,  H01L2924/16251 ,  H01L2924/182

Abstract: Provided is a semiconductor package including: at least one semiconductor device on a first substrate; a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment; and a molding member on the at least one semiconductor device in a lateral direction, wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.

公开(公告)号：US10553546B2

公开(公告)日：2020-02-04

申请号：US16037226

申请日：2018-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/367

Abstract: Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.

公开(公告)号：US12183653B2

公开(公告)日：2024-12-31

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Myung-Sung Kang ,  Yeongseok Kim ,  Gwangsun Seo ,  Hyein Yoo ,  Yongwon Choi

IPC: H01L23/373 ,  C09J7/28 ,  C09J11/04 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20220189902A1

公开(公告)日：2022-06-16

申请号：US17551387

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/498 ,  H01L21/66 ,  C08L63/00 ,  C08K3/013 ,  C08K5/00

Abstract: Provided is a semiconductor package including: at least one semiconductor device on a first substrate; a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment; and a molding member on the at least one semiconductor device in a lateral direction, wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.