公开(公告)号：US20210343342A1

公开(公告)日：2021-11-04

申请号：US17096245

申请日：2020-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun Lee ,  Sangwan NAM ,  Taemin OK

IPC: G11C16/04 ,  G11C16/26 ,  H01L23/528

Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.

公开(公告)号：US20250024682A1

公开(公告)日：2025-01-16

申请号：US18626466

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Rokgyeong Kim ,  Myunghun Lee

IPC: H10B43/40 ,  G11C16/08 ,  H10B41/27 ,  H10B41/41 ,  H10B43/27

Abstract: A semiconductor device may include a peripheral circuit region including a plurality of elements on a substrate, the plurality of elements providing a page buffer and a row decoder, wherein the peripheral circuit region includes a first well region and a second well region, and at least one of a conductivity-type of impurities or a doping concentration of the first well region is different from that of the second well region, wherein the row decoder includes at least one first element in the first well region, and at least one second element in the second well region, wherein the first well region and the second well region are configured to have a same body bias voltage, and wherein the first well region is in contact with the second well region in a second direction parallel to an upper surface of the substrate.

公开(公告)号：US11961560B2

公开(公告)日：2024-04-16

申请号：US17096245

申请日：2020-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun Lee ,  Sangwan Nam ,  Taemin Ok

IPC: H01L23/528 ,  G11C16/04 ,  G11C16/26 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

CPC classification number: G11C16/0483 ,  G11C16/26 ,  H01L23/528 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.

公开(公告)号：US12114066B2

公开(公告)日：2024-10-08

申请号：US17835209

申请日：2022-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun Lee

IPC: H04N23/661 ,  H04N23/63 ,  H04N23/80

CPC classification number: H04N23/661 ,  H04N23/632 ,  H04N23/80

Abstract: According to certain embodiments, an electronic device comprises: a communication module; and a processor operatively connected to the communication module and configured to transmit and receive data to and from external electronic devices through the communication module, and wherein the processor is configured to: receive a preview source image from a first external electronic device; performing a first image processing on the preview source image, thereby resulting in a preview image; transmitting the preview image to a second external electronic device and a third external electronic device; receive a request for second image processing from the second external electronic device; transmit a first modified preview image obtained by performing the second image processing on the preview image to the second external electronic device in response to the request; receive a request for third image processing form the third external electronic device; transmit a second modified preview image obtained by performing the third image processing on the preview image to the third external electronic device.

公开(公告)号：US20230403866A1

公开(公告)日：2023-12-14

申请号：US18297266

申请日：2023-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyoung KIM ,  Myunghun Lee

IPC: H10B80/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L21/768

CPC classification number: H10B80/00 ,  H01L24/08 ,  H01L23/481 ,  H01L23/528 ,  H01L24/05 ,  H01L21/76898 ,  H10B41/27

Abstract: A semiconductor device may include a first substrate structure including a plate layer, gate electrodes stacked on the plate layer, channel structures penetrating through the gate electrodes, and first bonding metal layers on the channel structures; and a second substrate structure connected to the first substrate structure, and including a substrate having active regions, device isolation layers in the substrate defining the active regions, circuit devices on one surface of the substrate, and second bonding metal layers connected to the first bonding metal layers, the device isolation layers including first device isolation layers and a second device isolation layer having different heights, and the active regions including first active regions spaced apart by the first device isolation layers and connected to each other by the substrate, and second active regions separated from the first active regions by the second device isolation layer.

公开(公告)号：US11062426B2

公开(公告)日：2021-07-13

申请号：US16292981

申请日：2019-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaewhan Lim ,  Myunghun Lee

IPC: G06T3/40 ,  G06T7/55 ,  G06K9/00 ,  H04N5/232 ,  H04N5/247 ,  H04N5/225

Abstract: An electronic device is provided. The electronic device includes image sensors configured to include a plurality of pairs of image sensors, each pair of image sensors facing in substantially the same direction and generating image data and each of which has a different field of view, a processor configured to be operatively connected to the image sensors, and a memory configured to be operatively connected to the processor. The memory stores instructions, when executed, causing the processor to receive at least one set of image data from the pairs of image sensors, recognize at least one object from the image data, determine depth information of the at least one object, and stitch the at least one set of image data using the at least one object and the depth information.