公开(公告)号：US20140220774A1

公开(公告)日：2014-08-07

申请号：US14171992

申请日：2014-02-04

Applicant: Samsung Electronics Co., Ltd

Inventor： Yo-Se EUM ,  Sang-Geun KIM ,  Seok-Yong LEE

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6838 ,  H01L24/11 ,  H01L2924/0002 ,  H05K2203/041 ,  Y10T29/41 ,  H01L2924/0001

Abstract: A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

Abstract translation: 提供一种形成封装的外部端子的方法，其中可以固定封装基​​板，可以支撑封装基板的边缘部分以防止封装基板的边缘部分向上弯曲，具有开口的掩模可以是 布置在封装衬底上，并且可以通过掩模的开口将外部端子提供给封装衬底。 支撑部分可以向下按压封装基板的边缘部分，使得封装基板的边缘部分不会向上弯曲。 结果，封装基板上的外部端子可以具有均匀的厚度。

公开(公告)号：US20140015129A1

公开(公告)日：2014-01-16

申请号：US14029394

申请日：2013-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Geun KIM ,  Dong-Chul HAN ,  Seok GOH ,  Jeong-Hoon KIM

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Abstract translation: 提供堆叠的包装和制造方法。 堆叠封装可以包括第一半导体封装，第二半导体封装，插头和间隔件。 第二半导体封装可以堆叠在第一半导体封装上。 插头可以将第一半导体电连接到第二半导体封装。 间隔件可以插入在第一半导体封装和第二半导体封装之间以在第一半导体封装和第二半导体封装之间形成间隙，从而防止插头之间的电短路。

公开(公告)号：US20130165190A1

公开(公告)日：2013-06-27

申请号：US13726921

申请日：2012-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Kwon KO ,  Sang-Geun KIM ,  Yong SEO ,  Nam-Jun KIM ,  Sang-Woon NAHM ,  Bong-Gun LEE ,  Yong-Jin LEE ,  Jin-Hee CHO

IPC: H05K5/03

CPC classification number: H05K5/03 ,  G06F1/1626 ,  G06F2200/1633 ,  H04M1/185

Abstract: A protection cover and a portable apparatus including the same are provided. The protection cover includes a front cover, a rear cover, and a coupling member. The front cover is mountable on the portable apparatus and covers a screen of the portable apparatus. The coupling member is formed of a flexible material such that the front cover is pivotable between and open and a closed position. The rear cover is mounted on the backside of the portable apparatus to serve as a rear case of the portable apparatus. The coupling member is integrally coupled with the front cover and separably coupled with the rear cover. According to the above structure, the protection cover can minimize the total volume and dimensions of the portable apparatus after it is mounted.

Abstract translation: 提供了保护盖和包括该保护盖的便携式设备。 保护盖包括前盖，后盖和联接构件。 前盖可安装在便携式设备上并覆盖便携式设备的屏幕。 联接构件由柔性材料形成，使得前盖能够在打开和关闭位置之间枢转。 后盖安装在便携式设备的背面，用作便携式设备的后壳。 联接构件与前盖一体地联接并与后盖可分离地联接。 根据上述结构，保护盖可以将便携式装置安装后的总体积和尺寸最小化。