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    Image sensor including color separating lens array and electronic apparatus including the image sensor
    5.
    发明授权
    Image sensor including color separating lens array and electronic apparatus including the image sensor 有权

    公开(公告)号：US12169289B2

    公开(公告)日：2024-12-17

    申请号：US17959608

    申请日：2022-10-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sookyoung Roh ,  Sangyun Lee ,  Sungmo Ahn ,  Seokho Yun

    IPC: G02B3/00 ,  H04N9/64 ,  H04N23/84

    Abstract: An image sensor includes a color separating lens array including a plurality of first pixel corresponding regions respectively corresponding to a plurality of first pixels and a plurality of second pixel corresponding regions respectively corresponding to a plurality of second pixels, wherein each of the plurality of first pixel corresponding regions and the plurality of second pixel corresponding regions includes a plurality of nanoposts, and at least one of a shape, a width, and an arrangement of the plurality of nanoposts of the plurality of first pixel corresponding regions changes according to an azimuth direction of the plurality of nanoposts in a peripheral portion surrounding a central portion of the color separating lens array.

    Image sensor and electronic apparatus including the image sensor
    7.
    发明授权
    Image sensor and electronic apparatus including the image sensor 有权

    公开(公告)号：US12174453B2

    公开(公告)日：2024-12-24

    申请号：US17947772

    申请日：2022-09-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangyun Lee ,  Sookyoung Roh ,  Seokho Yun ,  Sungmo Ahn

    IPC: H04N25/704 ,  G02B3/00 ,  G02B7/28 ,  G02B27/10 ,  G02B27/12 ,  G03B13/36 ,  H04N9/01

    Abstract: An image sensor includes a sensor substrate including first, second, third, and fourth pixels, and a color separating lens array, wherein each of the first pixels includes a first focusing signal region and a second focusing signal region that independently generate focusing signals, and the first focusing signal region and the second focusing signal region are arranged to be adjacent to each other in the first pixel in a first direction, and each of the fourth pixels includes a third focusing signal region and a fourth focusing signal region that independently generate focusing signals, and the third focusing signal region and the fourth focusing signal region are arranged to be adjacent to each other in the fourth pixel in a second direction that is different from the first direction.

    Image sensor including color separating lens array and electronic apparatus including the image sensor
    8.
    发明授权
    Image sensor including color separating lens array and electronic apparatus including the image sensor 有权

    公开(公告)号：US12169288B2

    公开(公告)日：2024-12-17

    申请号：US18208566

    申请日：2023-06-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seokho Yun ,  Sookyoung Roh ,  Sangyun Lee

    IPC: G02B3/00 ,  G02B27/10 ,  H04N23/60 ,  H04N25/11

    Abstract: Provided is an image sensor including a color separating lens array. The image sensor includes a sensor substrate including a first pixel configured to sense first wavelength light, and a second pixel configured to sense second wavelength light; and a color separating lens array including a first wavelength light condensing region in which the first wavelength light is condensed onto the first pixel, wherein an area of the first wavelength light condensing region is greater than an area of the first pixel, and a distance between the sensor substrate and the color separating lens array is less than a focal distance of the first wavelength light condensing region with respect to the first wavelength light.

    ELECTRONIC DEVICE INCLUDING SPEAKER MODULE
    9.
    发明公开
    ELECTRONIC DEVICE INCLUDING SPEAKER MODULE 审中-公开

    公开(公告)号：US20240098397A1

    公开(公告)日：2024-03-21

    申请号：US18387735

    申请日：2023-11-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taewoo NOH ,  Yongyoun Kim ,  Taeeon Kim ,  Dongyoung Lee ,  Joon Heo ,  Sangyun Lee ,  Isaac Jo

    IPC: H04R1/02 ,  H04M1/02

    CPC classification number: H04R1/028 ,  H04M1/0264 ,  H04M1/0266

    Abstract: An electronic device according to an embodiment of the disclosure may include a housing, a camera module disposed in the housing, a sound output module disposed in the housing to be spaced apart from the camera module, a first sound hole positioned on the front surface of the electronic device, a second sound hole which is positioned on a side surface of the electronic device and includes a dummy hole disposed to be adjacent to the sound output module and at least partially closed, and a connection hole spaced farther apart from the sound output module than the dummy hole, a sound outlet formed through the housing to allow sound generated in the sound output module to be output therethrough, and connected to the first sound hole and the second sound hole, and a sound guide part formed in the housing along a direction in which the first sound hole and the second sound hole extend, and configured to connect the sound outlet, the first sound hole, and the second sound hole.

    SEMICONDUCTOR PACKAGE
    10.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240038740A1

    公开(公告)日：2024-02-01

    申请号：US18329530

    申请日：2023-06-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyundong Lee ,  Youngmin Kim ,  Joonseok Oh ,  Sangyun Lee ,  Changbo Lee

    IPC: H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

    CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/3107 ,  H01L24/16 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15174

    Abstract: A semiconductor package includes a first wiring structure including a plurality of first redistribution patterns having a plurality of first bottom connection pads and a plurality of first top connection pads and a plurality of first redistribution insulating layers surrounding the plurality of first redistribution patterns, a second wiring structure including a plurality of second redistribution patterns having a plurality of second bottom connection pads and a plurality of second top connection pads and a plurality of second redistribution insulating layers surrounding the plurality of second redistribution patterns, a semiconductor chip interposed between the first wiring structure and the second wiring structure, an encapsulant filling a space between the first wiring structure and the second wiring structure, and a plurality of connection structures passing through the encapsulant and connecting the plurality of first top connection pads to the plurality of second bottom connection pads and arranged around the semiconductor chip.

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