SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20220415680A1

    公开(公告)日:2022-12-29

    申请号:US17664243

    申请日:2022-05-20

    Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

    ELECTRONIC DEVICE INCLUDING OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20180259388A1

    公开(公告)日:2018-09-13

    申请号:US15915835

    申请日:2018-03-08

    Abstract: An electronic device is disclosed and includes an optical sensor module, a window, a first shield-printed layer, and a second shield-printed layer. The optical sensor module includes a first optical sensor and a second optical sensor. The window covers the optical sensor module. The first shield-printed layer is printed in a first region for transmitting a sensor light from the first optical sensor on a lower surface of the window facing the optical sensor module. The second shield-printed layer is printed in a second region for transmitting a sensor light from the second optical sensor on the lower surface of the window. The first and second shield-printed layers are printed using a same coloring material.

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