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公开(公告)号:US11988712B2
公开(公告)日:2024-05-21
申请号:US17551974
申请日:2021-12-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chunghee Kim , Ahreum Kim , Minsu Kim , Seungman Lim
IPC: G01R31/3185
CPC classification number: G01R31/318541
Abstract: A multi-bit flip-flop includes a first flip-flop having a first output driver connected to a first output pin and arranged on a first row, a second flip-flop including a second output driver electrically connected to a second output pin and arranged on a second row, and an internal hold buffer connected to the first output driver on the first row and the second flip-flop on the second row.
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2.
公开(公告)号:US20210334449A1
公开(公告)日:2021-10-28
申请号:US17225773
申请日:2021-04-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jisu Yu , Jaeho Park , Sanghoon Baek , Hyeongyu You , Seungyoung Lee , Seungman Lim
IPC: G06F30/398 , H01L23/528 , H01L29/423 , G06F30/392 , G06F30/3953
Abstract: A method includes placing standard cells based on a standard cell library and generating layout data, and placing a filler cell selected from among a first type filler cell and a second type filler cell by using the layout data. The filler cell is placed based on a density of a pattern formed in the standard cell. The standard cell library includes data defining the first and second type filler cells. A density of a contact formed on an active region of the second type filler cell to contact the active region of the second type filler cell is lower than a density of a contact formed on an active region of a first type filler cell to contact the active region of the first type filler cell.
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3.
公开(公告)号:US12019965B2
公开(公告)日:2024-06-25
申请号:US17225773
申请日:2021-04-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jisu Yu , Jaeho Park , Sanghoon Baek , Hyeongyu You , Seungyoung Lee , Seungman Lim
IPC: G06F30/392 , G06F30/3953 , G06F30/398 , H01L23/528 , H01L29/423 , G06F117/12
CPC classification number: G06F30/392 , G06F30/3953 , G06F30/398 , H01L23/5283 , H01L23/5286 , H01L29/42376 , G06F2117/12
Abstract: A method includes placing standard cells based on a standard cell library and generating layout data, and placing a filler cell selected from among a first type filler cell and a second type filler cell by using the layout data. The filler cell is placed based on a density of a pattern formed in the standard cell. The standard cell library includes data defining the first and second type filler cells. A density of a contact formed on an active region of the second type filler cell to contact the active region of the second type filler cell is lower than a density of a contact formed on an active region of a first type filler cell to contact the active region of the first type filler cell.
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公开(公告)号:US20210184038A1
公开(公告)日:2021-06-17
申请号:US16893549
申请日:2020-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seungman Lim , Jaeho Park , Sanghoon Baek , Jisu YU , Hyeongyu You , Seungyoung Lee
IPC: H01L29/78 , H01L23/522
Abstract: A semiconductor device includes first and second active patterns, a first gate structure, first and second channels, and first and second source/drain layers. The first and second active patterns extend in a first direction, and are spaced apart in a second direction. The first gate structure extends in the second direction on the first and second active patterns. The first channels are spaced apart in a third direction on the first active pattern. The second channels are spaced apart in the third direction on the second active pattern. The first source/drain layer having a first conductivity type is formed at a side of the first gate structure to contact the first channels. The second source/drain layer having a second conductivity type is formed at a side of the first gate structure to contact the second channels. Widths in the second direction of the first and second channels are different.
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公开(公告)号:US12147751B2
公开(公告)日:2024-11-19
申请号:US17360355
申请日:2021-06-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungman Lim , Hakchul Jung , Sanghoon Baek , Jaewoo Seo , Jisu Yu , Hyeongyu You
IPC: G06F30/3953 , G06F30/327 , G06F119/06 , H01L23/528
Abstract: An integrated circuit includes a plurality of logic cells arranged in a first row extending in a first direction and including different types of active areas extending in the first direction, a filler cell arranged in a second row adjacent to the first row in a second direction orthogonal to the first direction and extending in the first direction, and a first routing wiring line arranged in the second row and connecting a first logic cell and a second logic cell apart from each other by a first distance among the plurality of logic cells. A height of the first row is different from a height of the second row.
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6.
公开(公告)号:US20240303410A1
公开(公告)日:2024-09-12
申请号:US18670009
申请日:2024-05-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jisu Yu , Jaeho Park , Sanghoon Baek , Hyeongyu You , Seungyoung Lee , Seungman Lim
IPC: G06F30/392 , G06F30/3953 , G06F30/398 , G06F117/12 , H01L23/528 , H01L29/423
CPC classification number: G06F30/392 , G06F30/3953 , G06F30/398 , H01L23/5283 , H01L23/5286 , H01L29/42376 , G06F2117/12
Abstract: A method includes placing standard cells based on a standard cell library and generating layout data, and placing a filler cell selected from among a first type filler cell and a second type filler cell by using the layout data. The filler cell is placed based on a density of a pattern formed in the standard cell. The standard cell library includes data defining the first and second type filler cells. A density of a contact formed on an active region of the second type filler cell to contact the active region of the second type filler cell is lower than a density of a contact formed on an active region of a first type filler cell to contact the active region of the first type filler cell.
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7.
公开(公告)号:US11901902B2
公开(公告)日:2024-02-13
申请号:US17696086
申请日:2022-03-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungman Lim , Minsu Kim , Ahreum Kim
IPC: H03K3/02 , H03K3/037 , H03K17/687 , H03K3/3562
CPC classification number: H03K3/0372 , H03K3/3562 , H03K17/6872
Abstract: An integrated circuit includes a flip-flop configured to operate in synchronization with a clock signal. The flip-flop includes a multiplexer configured to output an inverted signal of a scan input signal to a first node based on a scan enable signal, or the multiplexer configured to output an inverted signal of a data input signal or a signal having a first level to a first node based on a reset input signal, a master latch configured to latch the signal output through the first node, and to output the latched signal, and a slave latch configured to latch an output signal of the master latch and to output the latched output signal of the master latch.
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