公开(公告)号：US20170040293A1

公开(公告)日：2017-02-09

申请号：US15215583

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu KIM ,  Ji-sun HONG ,  Su-jung HYUNG ,  Hyun-ki KIM ,  Hyun LEE

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/498 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/14 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Abstract translation: 提供了一种印刷电路板（PCB），其能够在模制过程中阻止杂质的引入，以减少半导体封装的损坏，制造PCB的方法，以及通过使用PCB制造半导体封装的方法。 一个实施例包括一种装置，包括：衬底主体，包括在有源区的外部部分上的有源区和虚拟区，衬底主体沿第一方向纵向延伸; 安装在有源区上的多个半导体单元; 以及形成在所述虚拟区域上的屏障，其中所述屏障沿所述第一方向延伸。