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公开(公告)号:US12292773B2
公开(公告)日:2025-05-06
申请号:US18135886
申请日:2023-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wookwang Lee , Kwanhoe Ku , Kyounghoon Kim , Sukgyong Kim , Dongrak Shin
Abstract: An electronic device includes: a power management module; a connector; a device recognition circuit; and a processor. The processor is configured to: based on a first resistance value detected in a first recognition pin, control the power management module to supply a first power signal to a first power pin and to supply a second power signal to a second recognition pin; receive first identification information of an external device via the first recognition pin or the first data pin; and based on the first identification information, control the power management module to cut off a supply of a first power signal and to maintain a supply of the second power signal.
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公开(公告)号:US09961430B2
公开(公告)日:2018-05-01
申请号:US14596454
申请日:2015-01-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juhee Chang , Sukgyong Kim , Taeeon Kim , Cheolyong Park , Sunghoon Jeong , Juntai Kim , Sunyoung Lee
CPC classification number: H04R1/1041 , H04R1/1091 , H04R3/12 , H04R5/04 , H04R29/00 , H04R2430/01 , H04R2460/03
Abstract: A headset includes a first speaker; a second speaker; a connector connecting the first speaker and the second speaker; and a switch configured to generate different electrical signals according to states in which the first speaker and the second speaker move close to and away from each other, wherein the electrical signals are used to selectively control an output of contents that is being output from the headset.
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公开(公告)号:US12219311B2
公开(公告)日:2025-02-04
申请号:US17862841
申请日:2022-07-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jonghwan Kim , Kiwon Kim , Sukgyong Kim , Myeungseon Kim , Changmin Kim , Hakhoon Song
Abstract: The electronic device including the plurality of acoustic ducts according to various example embodiments may include the main body; the PCB disposed on the main body; the microphone including the microphone body connected to the PCB and the diaphragm connected to the microphone body; the main acoustic duct penetrating the main body and configured to connect the space in which the diaphragm is placed to the external space of the electronic device; and the sub acoustic duct penetrating the main body and configured to connect the external space of the electronic device to the main acoustic duct. In addition, various example embodiments are possible.
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公开(公告)号:US20230259188A1
公开(公告)日:2023-08-17
申请号:US18135886
申请日:2023-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wookwang LEE , Kwanhoe Ku , Kyounghoon Kim , Sukgyong Kim , Dongrak Shin
CPC classification number: G06F1/266 , G06F13/382 , G06F13/4282 , H04R1/1041 , G06F2213/0042 , H04R2420/09
Abstract: An electronic device includes: a power management module; a connector; a device recognition circuit; and a processor. The processor is configured to: based on a first resistance value detected in a first recognition pin, control the power management module to supply a first power signal to a first power pin and to supply a second power signal to a second recognition pin; receive first identification information of an external device via the first recognition pin or the first data pin; and based on the first identification information, control the power management module to cut off a supply of a first power signal and to maintain a supply of the second power signal.
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