THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
    1.
    发明公开

    公开(公告)号:US20230413545A1

    公开(公告)日:2023-12-21

    申请号:US18365915

    申请日:2023-08-04

    CPC classification number: H10B41/27 G11C16/0483 H01L23/535

    Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.

    SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20200227435A1

    公开(公告)日:2020-07-16

    申请号:US16686967

    申请日:2019-11-18

    Abstract: A semiconductor device includes gate electrodes spaced apart from each other in a first direction perpendicular to a substrate's upper surface, and extending by different lengths in a second direction perpendicular to the first direction. The device further includes first and second channels penetrating the gate electrodes and extending in the first direction, a horizontal portion disposed in lower portions of the gate electrodes and connecting lower portions of the first and second channels to each other, and a source line disposed in an upper portion of the second channel and connected to the second channel. The gate electrodes include memory cell electrodes included in memory cells, a first ground select electrode disposed in lower portions of the memory cell electrodes, a second ground select electrode disposed in upper portions of the memory cell electrodes, and a string select electrode disposed in upper portions of the memory cell electrodes.

    Nonvolatile memory device and method for fabricating the same

    公开(公告)号:US11910611B2

    公开(公告)日:2024-02-20

    申请号:US17507989

    申请日:2021-10-22

    CPC classification number: H10B43/40 H01L23/5226 H10B43/10 H10B43/27

    Abstract: A nonvolatile memory device includes a substrate including a cell region and a peripheral circuit region, a stacked structure on the cell region, the stacked structure including a plurality of gate patterns separated from each other and stacked sequentially, a semiconductor pattern connected to the substrate through the stacked structure, a peripheral circuit element on the peripheral circuit region, a first interlayer insulating film on the cell region and the peripheral circuit region, the first interlayer insulating film covering the peripheral circuit element, and a lower contact connected to the peripheral circuit element through the first interlayer insulating film, a height of a top surface of the lower contact being lower than or equal to a height of a bottom surface of a lowermost gate pattern of the plurality of gate patterns on the first interlayer insulating film.

    Semiconductor device
    6.
    发明授权

    公开(公告)号:US11139314B2

    公开(公告)日:2021-10-05

    申请号:US16686967

    申请日:2019-11-18

    Abstract: A semiconductor device includes gate electrodes spaced apart from each other in a first direction perpendicular to a substrate's upper surface, and extending by different lengths in a second direction perpendicular to the first direction. The device further includes first and second channels penetrating the gate electrodes and extending in the first direction, a horizontal portion disposed in lower portions of the gate electrodes and connecting lower portions of the first and second channels to each other, and a source line disposed in an upper portion of the second channel and connected to the second channel. The gate electrodes include memory cell electrodes included in memory cells, a first ground select electrode disposed in lower portions of the memory cell electrodes, a second ground select electrode disposed in upper portions of the memory cell electrodes, and a string select electrode disposed in upper portions of the memory cell electrodes.

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