公开(公告)号：US08736035B2

公开(公告)日：2014-05-27

申请号：US13785811

申请日：2013-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Joo Hwang ,  Tae-gyeong Chung ,  Eun-chul Ahn

IPC: H01L23/48 ,  H01L23/498 ,  H01L25/03 ,  H01L23/495 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L23/481 ,  H01L24/06 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.

Abstract translation: 半导体封装包括第一封装衬底，设置在第一封装衬底上的第一半导体芯片，包括第一通孔通孔的半导体芯片和设置在第一半导体芯片上的芯片封装，芯片封装包括第二封装衬底和 设置在所述第二封装基板上的第二半导体芯片，其中，第一导电端子设置在所述半导体芯片的第一表面上，并且第二导电端子设置在所述第二封装基板的第一表面上，所述第一导电端子设置在所述第二封装基板的第二表面上 导电端子。