公开(公告)号：US20170365582A1

公开(公告)日：2017-12-21

申请号：US15401341

申请日：2017-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwang Sun Seo ,  Myung Sung Kang ,  Won Keun Kim ,  Jin Woo Park ,  Yong Won Choi

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33505 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/1403 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.

公开(公告)号：US10896879B2

公开(公告)日：2021-01-19

申请号：US16201708

申请日：2018-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kun Sil Lee ,  Dong Kwan Kim ,  Bo Ram Kang ,  Ho Geon Song ,  Won Keun Kim

IPC: H01L23/552 ,  G01N23/18

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

公开(公告)号：US09991234B2

公开(公告)日：2018-06-05

申请号：US15401341

申请日：2017-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwang Sun Seo ,  Myung Sung Kang ,  Won Keun Kim ,  Jin Woo Park ,  Yong Won Choi

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33505 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/1403 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.