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公开(公告)号：US10546765B2
公开(公告)日：2020-01-28
申请号：US15474276
申请日：2017-03-30
发明人： Kyoung Whan Oh , Yeon Woo Choi , Won Yup Ko , Min Seok Moon , Won Ki Park , Seung Hwan Lee , Yong Won Choi
IPC分类号： H01L21/67 , H01L21/68 , B23K26/00 , B23K26/38 , B23K26/53 , H01L21/687 , B23K101/40 , B23K103/00
摘要： A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.
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公开(公告)号：US09991234B2
公开(公告)日：2018-06-05
申请号：US15401341
申请日：2017-01-09
发明人： Gwang Sun Seo , Myung Sung Kang , Won Keun Kim , Jin Woo Park , Yong Won Choi
IPC分类号： H01L23/48 , H01L25/065 , H01L23/31 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/561 , H01L23/3128 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33505 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2224/1403 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
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公开(公告)号：US20130099815A1
公开(公告)日：2013-04-25
申请号：US13655072
申请日：2012-10-18
发明人： Kwang Jun KIM , Tae Jun Sang , Hyun Sik Sim , Ki Hoon Nam , Yong Won Choi , Jong Hwi Seo
IPC分类号： G01R1/04
CPC分类号： G01R31/2893 , G01R31/2867
摘要： A probe card handling carriage is applicable to various working environments. The probe card handling carriage includes a main body provided to be travelable on the ground, a drawer unit provided to be movable in a forward and backward direction with respect to the main body, and a transfer robot installed on the drawer unit to transfer a probe card.
摘要翻译： 探针卡处理托架适用于各种工作环境。 探针卡处理托架包括设置成能够在地面上行驶的主体，设置成能够相对于主体沿前后方向移动的抽屉单元，以及安装在抽屉单元上以传送探针的传送机器人 卡。
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4.发明授权公开(公告)号：US11027394B2
公开(公告)日：2021-06-08
申请号：US16022166
申请日：2018-06-28
发明人： Jieun Yang , Dong-il Yoon , Taemin Earmme , Gui Hyun Cho , Seok Heo , Jong Hwi Seo , Yong Won Choi
IPC分类号： B24B37/34 , B24B37/005 , H01L21/687 , H01L21/67
摘要： Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.
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公开(公告)号：US10553464B2
公开(公告)日：2020-02-04
申请号：US15950303
申请日：2018-04-11
发明人： Jae Won Jeong , Yi Jin , Chang Gi Min , Jin Woo Lee , Seok Heo , Yong Won Choi , Yun Jong Choi
IPC分类号： H01L21/67 , G05B19/418
摘要： A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.
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公开(公告)号：US10442034B2
公开(公告)日：2019-10-15
申请号：US15281578
申请日：2016-09-30
发明人： Kyoung Whan Oh , Yeon Woo Choi , In Hwan Kim , Won Ki Park , Ho Youl Lee , Yong Won Choi
IPC分类号： B23K26/08 , B23K26/402 , B23K26/03 , B23K26/38 , H01L21/67 , H01L21/78 , B23K103/00 , B23K101/40
摘要： A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.
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公开(公告)号：US09081057B2
公开(公告)日：2015-07-14
申请号：US13655072
申请日：2012-10-18
发明人： Kwang Jun Kim , Tae Jun Sang , Hyun Sik Sim , Ki Hoon Nam , Yong Won Choi , Jong Hwi Seo
CPC分类号： G01R31/2893 , G01R31/2867
摘要： A probe card handling carriage is applicable to various working environments. The probe card handling carriage includes a main body provided to be travelable on the ground, a drawer unit provided to be movable in a forward and backward direction with respect to the main body, and a transfer robot installed on the drawer unit to transfer a probe card.
摘要翻译： 探针卡处理托架适用于各种工作环境。 探针卡处理托架包括设置成能够在地面上行驶的主体，设置成能够相对于主体沿前后方向移动的抽屉单元，以及安装在抽屉单元上以传送探针的传送机器人 卡。
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公开(公告)号：US20170365582A1
公开(公告)日：2017-12-21
申请号：US15401341
申请日：2017-01-09
发明人： Gwang Sun Seo , Myung Sung Kang , Won Keun Kim , Jin Woo Park , Yong Won Choi
IPC分类号： H01L25/065 , H01L23/31 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/561 , H01L23/3128 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33505 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2224/1403 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
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