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公开(公告)号：US10896917B2
公开(公告)日：2021-01-19
申请号：US16722155
申请日：2019-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Min Sung Song , Heung Jin Joo , Kwan Yong Kim , Jin Woo Park , Du Heon Song , He Jueng Lee , Myung Ho Jung
IPC: H01L27/1157 , H01L27/11582 , H01L27/11573 , H01L27/11565 , H01L27/11575 , G11C16/08
Abstract: In some embodiments, 3-dimensional semiconductor memory device includes a semiconductor substrate extending horizontally in a first direction and a second direction crossing the first direction. A stacked memory cell array is formed on the semiconductor substrate. The memory device further includes a separation pattern including a plurality of separation lines extending in the first direction and arranged in the second direction, and dividing the stacked memory cell array into a plurality of memory cell structures extending in the first direction and arranged in the second direction. An upper insulating layer is formed above the plurality of memory cell structures and separation lines, and a passivation layer is formed above the upper insulating layer. The passivation layer includes a plurality of first regions having a first vertical thickness. A plurality of gap regions in the passivation layer are formed between the plurality of first regions. The plurality of first regions vertically overlap the plurality of memory cell structures, and the plurality of gap regions vertically overlap the plurality of separation lines.
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公开(公告)号：US10684650B2
公开(公告)日：2020-06-16
申请号：US15988575
申请日：2018-05-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young Bae Sim , Hyun Suk Choi , Do Yeong Kim , Min Chul Kim , Sang Yup Lee , Sung Yoon Jung , Jin Woo Park , Ji Woo Lee , Yeun Wook Lim
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a touch screen display disposed between the first plate and the second plate, a fingerprint sensor, a digitizer including a layer having a conductive pattern, and a processor. The layer includes a first portion positioned between the second plate and a second area of the touch screen display that surrounds the first area when viewed from above the first plate and a second portion continuously extending from the first portion, the second portion positioned such that the fingerprint sensor is disposed between the second portion and the touch screen display, and such that the second portion is closer to the second plate than the first portion.
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公开(公告)号：US20170365582A1
公开(公告)日：2017-12-21
申请号：US15401341
申请日：2017-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gwang Sun Seo , Myung Sung Kang , Won Keun Kim , Jin Woo Park , Yong Won Choi
IPC: H01L25/065 , H01L23/31 , H01L23/00
CPC classification number: H01L25/0657 , H01L21/561 , H01L23/3128 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33505 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2224/1403 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
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公开(公告)号：US11670302B2
公开(公告)日：2023-06-06
申请号：US17097087
申请日：2020-11-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joo Hyuk Jeon , Woo Up Kwon , Jin Woo Park , Kyoung Gu Woo , Eun Taek Lim , Kyung Hak Hyun , Dong Ho Jang
CPC classification number: G10L15/26 , G06F3/167 , G06F40/274 , G06F40/35 , G06F40/40 , G10L15/16 , G10L15/22 , G10L2015/223 , G10L2015/228 , H04W88/02
Abstract: An electronic device and method are disclosed herein. The electronic device includes a network interface and processor. The processor implements the method, including receiving a voice input through a network interface as transmitted from a first external device, including a request to execute a function using at least one application which is not indicated in the voice input, extracting a first text from the voice input by executing automatic speech recognition (ASR), when the at least one application is identified based on the first text, transmitting, through the network interface to the first external device, second data associated with the identified at least one application for display by the first external device, and when the at least one application is not identified based at least in part on the first text, reattempting identification of the at least one application by executing natural language understanding (NLU) on the first text.
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公开(公告)号：US10529736B2
公开(公告)日：2020-01-07
申请号：US16138416
申请日：2018-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Min Sung Song , Heung Jin Joo , Kwan Yong Kim , Jin Woo Park , Du Heon Song , He Jueng Lee , Myung Ho Jung
IPC: H01L27/11582 , H01L27/1157 , H01L27/11573 , G11C16/08
Abstract: In some embodiments, 3-dimensional semiconductor memory device includes a semiconductor substrate extending horizontally in a first direction and a second direction crossing the first direction. A stacked memory cell array is formed on the semiconductor substrate. The memory device further includes a separation pattern including a plurality of separation lines extending in the first direction and arranged in the second direction, and dividing the stacked memory cell array into a plurality of memory cell structures extending in the first direction and arranged in the second direction. An upper insulating layer is formed above the plurality of memory cell structures and separation lines, and a passivation layer is formed above the upper insulating layer. The passivation layer includes a plurality of first regions having a first vertical thickness. A plurality of gap regions in the passivation layer are formed between the plurality of first regions. The plurality of first regions vertically overlap the plurality of memory cell structures, and the plurality of gap regions vertically overlap the plurality of separation lines.
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Patent Agency Ranking
公开(公告)号：US20180341290A1
公开(公告)日：2018-11-29
申请号：US15988575
申请日：2018-05-24
Applicant: Samsung Electronics Co .. Ltd.
Inventor： Young Bae Sim , Hyun Suk Choi , DoYeong Kim , Min Chul Kim , Sang Yup Lee , Sung Yoon Jung , Jin Woo Park , Ji Woo Lee , Yeun Wook Lim
IPC: G06F1/16 , H05K5/00 , G06F3/0354 , G06F3/042
CPC classification number: G06F1/1643 , G06F1/1626 , G06F1/163 , G06F1/1637 , G06F1/1658 , G06F1/1684 , G06F3/03545 , G06F3/041 , G06F3/042 , G06K9/00013 , G06K9/0004 , G06K9/22 , H05K5/0017 , H05K5/0086 , H05K9/0054
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a touch screen display disposed between the first plate and the second plate, a fingerprint sensor, a digitizer including a layer having a conductive pattern, and a processor. The layer includes a first portion positioned between the second plate and a second area of the touch screen display that surrounds the first area when viewed from above the first plate and a second portion continuously extending from the first portion, the second portion positioned such that the fingerprint sensor is disposed between the second portion and the touch screen display, and such that the second portion is closer to the second plate than the first portion.
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公开(公告)号：US10956764B2
公开(公告)日：2021-03-23
申请号：US16499938
申请日：2018-04-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joo Han Kim , Jin Man Kim , Byung Kyu Kim , Jin Woo Park , Young Bae Sim , Yeun Wook Lim
Abstract: An electronic device according to various embodiments of the present invention comprises: a display panel; a biometric sensor module disposed on the back surface of the display panel; a processor electrically connected to the display panel and the biometric sensor module, and configured to acquire biometric information by using the biometric sensor module; a first adhesive member filling the gap formed between the back surface of the display panel and the biometric sensor module; and a second adhesive member applied on the first adhesive member, wherein the biometric sensor module can be attached to the back surface of the display panel by using the second adhesive member. In addition, other embodiments are possible.
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公开(公告)号：US10811008B2
公开(公告)日：2020-10-20
申请号：US16014725
申请日：2018-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyoung Gu Woo , Woo Up Kwon , Jin Woo Park , Eun Taek Lim , Joo Hyuk Jeon , Ji Hyun Kim , Dong Ho Jang
Abstract: A system for processing a user utterance is provided. The system includes at least one network interface; at least one processor operatively connected to the at least one network interface; and at least one memory operatively connected to the at least one processor, wherein the at least one memory stores a plurality of specified sequences of states of at least one external electronic device, wherein each of the specified sequences is associated with a respective one of domains, wherein the at least one memory further stores instructions that, when executed, cause the at least one processor to receive first data associated with the user utterance provided via a first of the at least one external electronic device, wherein the user utterance includes a request for performing a task using the first of the at least one external device.
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公开(公告)号：US10575798B2
公开(公告)日：2020-03-03
申请号：US15504737
申请日：2015-07-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Ik Kim , Jin Woo Park , Hyung Jin Ham
Abstract: An x-ray detecting apparatus having a housing, a detecting panel provided at an inside the housing as to detect x-rays, and a circuit board having a first surface thereof bordering with the detecting panel and a second surface thereof provided with at least one electronic component installed thereto is provided.
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公开(公告)号：US09991234B2
公开(公告)日：2018-06-05
申请号：US15401341
申请日：2017-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gwang Sun Seo , Myung Sung Kang , Won Keun Kim , Jin Woo Park , Yong Won Choi
IPC: H01L23/48 , H01L25/065 , H01L23/31 , H01L23/00
CPC classification number: H01L25/0657 , H01L21/561 , H01L23/3128 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33505 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2224/1403 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
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