Abstract:
Semiconductor light-emitting devices, and semiconductor light-emitting packages, include at least one light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a substrate, the at least one light-emitting structure having a first region and a second region delimiting the first region. The light-emitting device includes a groove in the second region, and the groove is adjacent to an edge of the substrate and extends parallel to the edge of the substrate.
Abstract:
An image processing apparatus, and a method for controlling the image processing apparatus are disclosed. The image processing apparatus includes a data reader comprising data reading circuitry configured to read original data recorded on a storage medium, a signal processor configured to extract an audio stream and a video stream from the original data and to convert a format of the extracted audio stream and a format of the extracted video stream into a predetermined format, a communication module comprising communication circuitry configured to communicate with an external server, and a controller configured to control, when the data reader detects a read error or when the signal processor detects a demuxing error or a conversion error, the communication module to request the external server for at least one of: format-converted audio data and format-converted video data corresponding to a section in which the read error, the demuxing error, or the conversion error is detected.
Abstract:
A light emitting device package includes: a package board including a first electrode structure and a second electrode structure; and a light emitting device mounted on the package board and configured to emit light, the light emitting device including: light emitting structures provided on a growth substrate, electrically connected in series, and including an input terminal and an output terminal; a first solder pad and a second solder pad electrically connected to the input terminal and the output terminal, respectively, and in contact with the first and second electrode structures; and dummy solder pads provided on the light emitting structures and electrically insulated from the light emitting structures.