公开(公告)号：US20170358564A1

公开(公告)日：2017-12-14

申请号：US15622394

申请日：2017-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-young Lee ,  Joon-young Oh ,  Sung-wook Hwang ,  Yeoung-jun Cho

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/02381 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49105 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/45099

Abstract: A semiconductor package may be composed of a variety of different types of semiconductor chips of different sizes and support structures stacked within the semiconductor package. Semiconductor chips having a larger chip size may be stacked above smaller semiconductor chips. Smaller chips may be included in a layer of the semiconductor package along with a support structure which may assist supporting upper semiconductor chips, such as during a wire bonding process connecting bonding wires to chip pads of the semiconductor chips above the support structure. Use of different thicknesses of die attach film may allow for a further reduction in height of the semiconductor package. When implemented as a package housing a memory controller, DRAM semiconductor chips and non-volatile memory chips, locating the memory controller in a lower layer of the semiconductor package facilitates usage of the package substrate as a redistribution layer to provide communications between the memory controller and the DRAM and non-volatile memory chips.

公开(公告)号：US10204892B2

公开(公告)日：2019-02-12

申请号：US15622394

申请日：2017-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-young Lee ,  Joon-young Oh ,  Sung-wook Hwang ,  Yeoung-jun Cho

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor package may be composed of a variety of different types of semiconductor chips of different sizes and support structures stacked within the semiconductor package. Semiconductor chips having a larger chip size may be stacked above smaller semiconductor chips. Smaller chips may be included in a layer of the semiconductor package along with a support structure which may assist supporting upper semiconductor chips, such as during a wire bonding process connecting bonding wires to chip pads of the semiconductor chips above the support structure. Use of different thicknesses of die attach film may allow for a further reduction in height of the semiconductor package. When implemented as a package housing a memory controller, DRAM semiconductor chips and non-volatile memory chips, locating the memory controller in a lower layer of the semiconductor package facilitates usage of the package substrate as a redistribution layer to provide communications between the memory controller and the DRAM and non-volatile memory chips.