公开(公告)号：US20170077348A1

公开(公告)日：2017-03-16

申请号：US15141222

申请日：2016-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wan Tae LIM ,  Yong II Kim ,  Nam Goo Cha ,  Sung Hyun Sim

IPC: H01L33/14 ,  H01L33/12 ,  H01L33/00 ,  H01L33/40 ,  H01L33/46 ,  H01L33/62 ,  H01L33/06 ,  H01L33/32

CPC classification number: H01L33/14 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a magnetic layer on the light-emitting structure. The magnetic layer may have at least one magnetization direction that is parallel to an upper surface of the active layer. The magnetic layer may generate a magnetic field that is parallel to the upper surface of the active layer. The magnetic layer may include multiple structures that may have different magnetization directions. Multiple magnetic layers may be included on the light-emitting structure. A magnetic layer may be on a contact electrode. A magnetic layer may be isolated from a pad electrode.

Abstract translation: 半导体发光器件包括在发光结构上包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构和磁性层。 磁性层可以具有平行于有源层的上表面的至少一个磁化方向。 磁性层可以产生平行于有源层的上表面的磁场。 磁性层可以包括可以具有不同磁化方向的多个结构。 多个磁性层可以包括在发光结构上。 磁性层可以在接触电极上。 磁性层可以与焊盘电极隔离。

公开(公告)号：US20190189876A1

公开(公告)日：2019-06-20

申请号：US15995546

申请日：2018-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Gun LEE ,  Yong II Kim ,  Han Kyu Seong ,  Ji Hye Yeon ,  Jin Sub Lee ,  Young Jin Choi

IPC: H01L33/62 ,  H01L33/44 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60

Abstract: A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.