公开(公告)号：US20150333148A1

公开(公告)日：2015-11-19

申请号：US14660191

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungbum KOO ,  Seungjae Lee ,  Shinhye Kim ,  Zulkarnain ,  Narae Oh ,  Jeong-Kyu Lee

IPC: H01L29/66 ,  H01L21/283 ,  H01L21/31 ,  H01L21/3105 ,  H01L23/528 ,  H01L21/3213 ,  H01L21/768 ,  H01L29/78 ,  H01L27/11 ,  H01L29/423 ,  H01L21/311

CPC classification number: H01L29/66545 ,  H01L21/283 ,  H01L21/31 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/32133 ,  H01L21/768 ,  H01L21/76897 ,  H01L23/528 ,  H01L27/1104 ,  H01L29/165 ,  H01L29/4232 ,  H01L29/66636 ,  H01L29/78 ,  H01L29/7848 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are provided. The methods may include forming a sacrificial gate pattern on a substrate, forming a first spacer on a sidewall of the sacrificial gate pattern and forming a first interlayer dielectric (ILD) layer covering a sidewall of the first spacer and exposing a top surface of the first spacer. The first spacer may expose an upper portion of the sidewall of the sacrificial gate pattern. The methods may also include forming a capping insulating pattern covering top surfaces of the first spacer and the first ILD layer, replacing the sacrificial gate pattern with a gate electrode structure and patterning the capping insulating pattern to form a second spacer on the first spacer and between the gate electrode structure and the first ILD layer. The second spacer may be formed of a material having a dielectric constant higher than a dielectric constant of the first spacer.

Abstract translation: 提供了制造半导体器件的半导体器件和方法。 所述方法可以包括在衬底上形成牺牲栅极图案，在牺牲栅极图案的侧壁上形成第一间隔物，并形成覆盖第一间隔物的侧壁的第一层间电介质（ILD）层，并暴露第一间隔物的顶表面 间隔 第一间隔物可以暴露牺牲栅极图案的侧壁的上部。 所述方法还可以包括形成覆盖第一间隔物和第一ILD层的顶表面的封盖绝缘图案，用栅极电极结构代替牺牲栅极图案，并且图案化封盖绝缘图案以在第一间隔物上形成第二间隔物， 栅电极结构和第一ILD层。 第二间隔物可以由具有高于第一间隔物的介电常数的介电常数的材料形成。

公开(公告)号：US08906761B2

公开(公告)日：2014-12-09

申请号：US13798700

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shinhye Kim ,  Sangho Rha ,  Jeong-Kyu Lee ,  Zulkarnain ,  Kyungseok Oh ,  Sangbom Kang ,  Seungjae Lee ,  Jungchan Lee

IPC: H01L29/739 ,  H01L29/66

CPC classification number: H01L29/66666 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76829 ,  H01L21/76837 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/517 ,  H01L29/66545

Abstract: A semiconductor device is manufactured using an expandable material. The method includes forming a first gate insulating layer on a substrate, forming first and second gate structures on the first gate insulating layer, the first and second gate structures being spaced apart from each other at a distance, forming an expandable material on sidewalls and upper surfaces of the first and second gate structures, forming a gap-fill layer on the expandable material between the first and second gate structures, and performing a heat-treatment process to increase the volume of the expandable material.

Abstract translation: 使用可膨胀材料制造半导体器件。 该方法包括在衬底上形成第一栅极绝缘层，在第一栅极绝缘层上形成第一和第二栅极结构，第一和第二栅极结构彼此间隔一定距离，在侧壁和上部形成可膨胀材料 第一和第二栅极结构的表面，在第一和第二栅极结构之间的可膨胀材料上形成间隙填充层，并且执行热处理工艺以增加可膨胀材料的体积。

公开(公告)号：US20140073125A1

公开(公告)日：2014-03-13

申请号：US13798700

申请日：2013-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shinhye Kim ,  Sangho Rha ,  Jeong-Kyu Lee ,  Zulkarnain ,  Kyungseok Oh ,  Sangbom Kang ,  Seungjae Lee ,  Jungchan Lee

IPC: H01L29/66

CPC classification number: H01L29/66666 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76829 ,  H01L21/76837 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/517 ,  H01L29/66545

Abstract: A semiconductor device is manufactured using an expandable material. The method includes forming a first gate insulating layer on a substrate, forming first and second gate structures on the first gate insulating layer, the first and second gate structures being spaced apart from each other at a distance, forming an expandable material on sidewalls and upper surfaces of the first and second gate structures, forming a gap-fill layer on the expandable material between the first and second gate structures, and performing a heat-treatment process to increase the volume of the expandable material.

Abstract translation: 使用可膨胀材料制造半导体器件。 该方法包括在衬底上形成第一栅极绝缘层，在第一栅极绝缘层上形成第一和第二栅极结构，第一和第二栅极结构彼此间隔一定距离，在侧壁和上部形成可膨胀材料 第一和第二栅极结构的表面，在第一和第二栅极结构之间的可膨胀材料上形成间隙填充层，并且执行热处理工艺以增加可膨胀材料的体积。