公开(公告)号：US20230384667A1

公开(公告)日：2023-11-30

申请号：US18155545

申请日：2023-01-17

Applicant: Samsung SDI Co., Ltd.

Inventor： Seol Hee LIM ,  Jaebum LIM ,  Yaeun SEO ,  Sumin JANG ,  Soobin LIM ,  Minyoung LEE ,  Jimin KIM ,  Jaeyeol BAEK ,  Eunmi KANG ,  Changsoo WOO

IPC: G03F7/004 ,  C07F7/22 ,  H01L21/027 ,  H01L21/308 ,  H01L21/311 ,  H01L21/3213

CPC classification number: G03F7/0042 ,  C07F7/2224 ,  H01L21/0271 ,  H01L21/3081 ,  H01L21/31144 ,  H01L21/32139

Abstract: A semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same are disclosed.

公开(公告)号：US20240345478A1

公开(公告)日：2024-10-17

申请号：US18587344

申请日：2024-02-26

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Soobin LIM ,  Young Keun KIM ,  Eunmi KANG ,  Seol Hee LIM

IPC: G03F7/004 ,  C07F7/22 ,  H01L21/027 ,  H01L21/311 ,  H01L21/3213

CPC classification number: G03F7/0042 ,  C07F7/2224 ,  H01L21/0271 ,  H01L21/31144 ,  H01L21/32139

Abstract: Disclosed are a semiconductor photoresist composition including an organotin compound represented by Chemical Formula 1, and a solvent, a method of forming patterns using the same.

公开(公告)号：US20250155799A1

公开(公告)日：2025-05-15

申请号：US18917822

申请日：2024-10-16

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Soobin LIM ,  Yaeun SEO ,  Sumin JANG ,  Changsoo WOO ,  Minyoung LEE ,  Taegeun SEONG ,  Eunmi KANG ,  Jimin KIM ,  Seungwoo JANG ,  Seung-Wook SHIN

IPC: G03F7/004 ,  G03F7/00 ,  G03F7/16 ,  H01L21/027

Abstract: A semiconductor photoresist composition including an organometallic compound; and a mixed solvent including an alcohol-based compound and a non-alcohol-based compound in a weight ratio of about 1:99 to about 30:70.

公开(公告)号：US20250054758A1

公开(公告)日：2025-02-13

申请号：US18787853

申请日：2024-07-29

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dong Wan RYU ,  Eunmi KANG ,  Young Keun Kim ,  Seol Hee LIM ,  Soobin LIM ,  Sukil KANG

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3205 ,  H01L21/3213

Abstract: A semiconductor photoresist composition includes: an organic tin compound represented by Chemical Formula 1; and a solvent: where the detailed description of Chemical Formula 1 is as described in the specification. In addition, a method of forming patterns includes: forming an etching-objective layer on a substrate; coating the semiconductor photoresist composition on the etching-objective layer to form a photoresist layer; patterning the photoresist layer to form a photoresist pattern; and etching the etching-objective layer with the photoresist pattern as an etching mask.

公开(公告)号：US20240345477A1

公开(公告)日：2024-10-17

申请号：US18587235

申请日：2024-02-26

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dong Wan RYU ,  Young Keun KIM ,  Seol Hee LIM ,  Soobin LIM ,  Sukil KANG

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/20

CPC classification number: G03F7/0042 ,  G03F7/0048 ,  G03F7/027 ,  G03F7/2006

Abstract: Disclosed are a semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1, and a solvent, a method of forming patterns using the same.

公开(公告)号：US20240241437A1

公开(公告)日：2024-07-18

申请号：US18473132

申请日：2023-09-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seol Hee LIM ,  Changsoo WOO ,  Young Keun KIM ,  Dong Wan RYU ,  Soobin LIM ,  Sukil KANG ,  Eunmi KANG

IPC: G03F7/004 ,  C07F7/22

CPC classification number: G03F7/0042 ,  C07F7/2284

Abstract: A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include an organotin compound represented by Chemical Formula 1 and a solvent.

公开(公告)号：US20240061336A1

公开(公告)日：2024-02-22

申请号：US18323358

申请日：2023-05-24

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Changsoo WOO ,  Seung HAN ,  Seungyong CHAE ,  Minyoung LEE ,  Jimin KIM ,  Sumin JANG ,  Sangkyun IM ,  Yaeun SEO ,  Eunmi KANG ,  Soobin LIM ,  Kyungsoo MOON

IPC: G03F7/039 ,  G03F7/004

CPC classification number: G03F7/039 ,  G03F7/0045 ,  G03F7/0044

Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include a first organometallic compound represented by Chemical Formula 1, a second organometallic compound represented by Chemical Formula 2, and a solvent, where the first organometallic compound is different from the second organometallic compound, at least one selected from among R1 and L1 may include a tertiary carbon, and at least one selected from among R2 and L2 may include at least one selected from among a primary carbon and a secondary carbon.