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    Light emitting diode array module for providing backlight and backlight unit having the same
    8.
    发明申请
    Light emitting diode array module for providing backlight and backlight unit having the same 有权
    用于提供背光和背光单元的发光二极管阵列模块

    公开(公告)号：US20050243576A1

    公开(公告)日：2005-11-03

    申请号：US10890201

    申请日：2004-07-14

    申请人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

    发明人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

    IPC分类号： F21S2/00 ,  F21V5/00 ,  F21V5/04 ,  F21V7/04 ,  F21Y101/02 ,  G02F1/1335 ,  G02F1/13357 ,  H01L33/00 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60

    CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

    摘要： The present invention provides a Light Emitting Diode (LED) array module for providing backlight, which can be used as an independent device with a plurality of LEDs being integrally packaged, and which can be universally used regardless of a screen size, and a backlight unit having the same. The LED array module used as a light source of backlight includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

    摘要翻译： 本发明提供了一种用于提供背光的发光二极管（LED）阵列模块，其可以用作具有整体封装的多个LED的独立装置，并且可以普遍使用，而不管屏幕尺寸如何，以及背光单元 有同样的 用作背光源的LED阵列模块包括形成有用于发射功率的导电图案的条形印刷电路板（PCB），形成在PCB上的由导热材料制成的基底，多个LED 芯片安装在基座上并与PCB的导电图形电连接，形成为围绕多个LED芯片的反射镜，并且适于反射从多个LED芯片向上辐射的光，以及形成在 多个LED芯片和反射器具有条形并且适于在水平方向上扩散从多个LED芯片和反射器辐射的光。

    Variable capacitor, impedance matching device, mobile terminal thereof and method for matching impedance
    9.
    发明授权
    Variable capacitor, impedance matching device, mobile terminal thereof and method for matching impedance 有权
    可变电容器，阻抗匹配装置，其移动终端和匹配阻抗的方法

    公开(公告)号：US09484880B2

    公开(公告)日：2016-11-01

    申请号：US13989281

    申请日：2011-11-07

    申请人： Chang Wook Kim

    发明人： Chang Wook Kim

    IPC分类号： H03H7/38 ,  H01G7/00 ,  H03H7/00

    CPC分类号： H03H7/38 ,  H01G7/00 ,  H03H2007/008

    摘要： Disclosed is an impedance matching device. Variable devices of the impedance matching device installed in a mobile terminal, such as a portable terminal, are configured to have a MEMS structure. The MEMS structure and other components are integrated as one package, so the manufacturing cost is reduced and the manufacturing efficiency is improved.

    摘要翻译： 公开了一种阻抗匹配装置。 安装在诸如便携式终端的移动终端中的阻抗匹配装置的可变装置被配置为具有MEMS结构。 MEMS结构等组件集成为一体，降低制造成本，提高制造效率。

    High power light emitting diode package
    10.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE44811E1

    公开(公告)日：2014-03-18

    申请号：US13330239

    申请日：2011-12-19

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC分类号： H01L21/00

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。