Semiconductor memory device having repair circuit
    1.
    发明申请
    Semiconductor memory device having repair circuit 失效
    具有修复电路的半导体存储器件

    公开(公告)号:US20050162945A1

    公开(公告)日:2005-07-28

    申请号:US11015419

    申请日:2004-12-20

    IPC分类号: G11C7/00 G11C29/00

    CPC分类号: G11C29/808

    摘要: A semiconductor memory device, including: a plurality of banks each of which includes a plurality of memory cells, a plurality of redundancy memory cells for replacing a defective memory cell and a repair circuit, having a plurality of fuse sets, for substituting an address to thereby access the redundancy memory cell instead of the defective memory cell; and a common repair circuit, having a plurality of fuse sets, for substituting the address in order to replace the defective memory cell with the redundancy memory cell included in any of the plurality of banks.

    摘要翻译: 一种半导体存储器件,包括:多个存储体,每个存储体包括多个存储单元,用于替换有缺陷存储单元的多个冗余存储单元和具有多个熔丝组的修复电路,用于将地址替换为 从而访问冗余存储单元而不是有缺陷的存储单元; 以及具有多个熔丝组的通用修复电路,用于代替所述地址以便用所述多个存储体中的任一个中包含的所述冗余存储单元替换所述有缺陷的存储单元。

    Semiconductor memory device having repair circuit
    2.
    发明授权
    Semiconductor memory device having repair circuit 失效
    具有修复电路的半导体存储器件

    公开(公告)号:US07099209B2

    公开(公告)日:2006-08-29

    申请号:US11015419

    申请日:2004-12-20

    IPC分类号: G11C7/00

    CPC分类号: G11C29/808

    摘要: A semiconductor memory device, including: a plurality of banks each of which includes a plurality of memory cells, a plurality of redundancy memory cells for replacing a defective memory cell and a repair circuit, having a plurality of fuse sets, for substituting an address to thereby access the redundancy memory cell instead of the defective memory cell; and a common repair circuit, having a plurality of fuse sets, for substituting the address in order to replace the defective memory cell with the redundancy memory cell included in any of the plurality of banks.

    摘要翻译: 一种半导体存储器件,包括:多个存储体,每个存储体包括多个存储单元,用于替换有缺陷存储单元的多个冗余存储单元和具有多个熔丝组的修复电路,用于将地址替换为 从而访问冗余存储单元而不是有缺陷的存储单元; 以及具有多个熔丝组的通用修复电路,用于代替所述地址以便用所述多个存储体中的任一个中包含的所述冗余存储单元替换所述有缺陷的存储单元。

    Semiconductor memory input/output device
    3.
    发明授权
    Semiconductor memory input/output device 有权
    半导体存储器输入/输出装置

    公开(公告)号:US08009504B2

    公开(公告)日:2011-08-30

    申请号:US12339389

    申请日:2008-12-19

    IPC分类号: G11C8/00

    摘要: A semiconductor memory input/output device includes selection pads used to input and output signals for multiple operation modes and having multiple functions, a control signal generator for outputting setting signals and a mask control signal, a lower input/output unit including a lower output buffer for outputting a read data strobe signal to a selection pad and a lower input buffer for receiving a lower data mask signal from the selection pad, and selecting one operation of the lower output buffer and the lower input buffer, and an upper input/output unit including an upper output buffer for outputting an inverted read data strobe signal to the second selection pad and an upper input buffer for receiving an upper data mask signal from the second selection pad, and selecting one operation of the upper output buffer and the upper input buffer.

    摘要翻译: 半导体存储器输入/输出装置包括用于输入和输出用于多个操作模式的信号并具有多个功能的选择焊盘,用于输出设置信号的控制信号发生器和掩模控制信号,包括下部输出缓冲器 用于将选择焊盘的读取数据选通信号输出到选择焊盘的下部数据屏蔽信号,以及选择下部输出缓冲器和下部输入缓冲器的一个动作,以及上部输入输出部 包括用于向第二选择焊盘输出反转的读数据选通信号的上输出缓冲器和用于从第二选择焊盘接收上数据掩码信号的上输入缓冲器,以及选择上输出缓冲器和上输入缓冲器的一个操作 。

    Semiconductor memory device
    4.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US07573757B2

    公开(公告)日:2009-08-11

    申请号:US12073294

    申请日:2008-03-04

    IPC分类号: G11C11/063

    摘要: Disclosed herein is a semiconductor memory device for reducing a current consumption used for operating a write command or a read command. The semiconductor memory device includes a global data latch unit for latching a global data loaded on a global data line in response to a first write enable signal to thereby generate a global latch data; a local data write driving unit for receiving the global latch data to output a local data to a local data line in response to a second write enable signal; and a write driver control unit for generating the first write enable signal and the second write enable signal to inactivate the first write enable signal when a write operation is not performed.

    摘要翻译: 这里公开了一种用于减少用于操作写入命令或读取命令的电流消耗的半导体存储器件。 半导体存储器件包括全局数据锁​​存单元,用于响应于第一写使能信号来锁存加载在全局数据线上的全局数据,从而生成全局锁存数据; 本地数据写驱动单元,用于接收全局锁存数据,以响应于第二写使能信号将本地数据输出到本地数据线; 以及写入驱动器控制单元,用于在不执行写入操作时产生第一写入使能信号和第二写入使能信号以使第一写入使能信号失活。

    Semiconductor memory device
    5.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US07359256B2

    公开(公告)日:2008-04-15

    申请号:US11312610

    申请日:2005-12-21

    IPC分类号: G11C7/00

    摘要: Disclosed herein is a semiconductor memory device for reducing a current consumption used for operating a write command or a read command. The semiconductor memory device includes a global data latch unit for latching a global data loaded on a global data line in response to a first write enable signal to thereby generate a global latch data; a local data write driving unit for receiving the global latch data to output a local data to a local data line in response to a second write enable signal; and a write driver control unit for generating the first write enable signal and the second write enable signal to inactivate the first write enable signal when a write operation is not performed.

    摘要翻译: 这里公开了一种用于减少用于操作写入命令或读取命令的电流消耗的半导体存储器件。 半导体存储器件包括全局数据锁​​存单元,用于响应于第一写使能信号来锁存加载在全局数据线上的全局数据,从而生成全局锁存数据; 本地数据写驱动单元,用于接收全局锁存数据,以响应于第二写使能信号将本地数据输出到本地数据线; 以及写入驱动器控制单元,用于在不执行写入操作时产生第一写入使能信号和第二写入使能信号以使第一写入使能信号失活。

    Semiconductor memory device
    6.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US07616630B2

    公开(公告)日:2009-11-10

    申请号:US11024907

    申请日:2004-12-30

    IPC分类号: H04L12/50

    摘要: A semiconductor memory device resolves skew problem due to delay difference between the case when data that is inputted through data input/output (IO) pin is transferred to one global I/O bus and the case when transferred to another global I/O bus based on data width option. The semiconductor memory device includes a first data IO pad formed at one side of a chip, a second data IO pad formed at the other one, a first global data bus receiving data from the first data IO pad, a second global data bus receiving data from the second data IO pad, a first data path for transferring data from the first data IO pad to the first global data bus, a second data path for transferring data from the first data IO pad to the second global data bus, and a third data path for transferring data inputted to the second data IO pad to the first global data bus depending on data width option, wherein data transfer time of the second data path is substantially equal to data transfer time of the third data path.

    摘要翻译: 半导体存储器件解决由于通过数据输入/输出(IO)引脚输入的数据被传送到一个全局I / O总线的情况下的延迟差异以及当转移到另一个全局I / O总线时的情况下的偏斜问题 on数据宽度选项。 半导体存储器件包括形成在芯片一侧的第一数据IO焊盘,在另一侧形成的第二数据IO焊盘,第一全局数据总线从第一数据IO焊盘接收数据,第二全局数据总线接收数据 来自第二数据IO垫的第一数据路径,用于将数据从第一数据IO焊盘传送到第一全局数据总线;第二数据通路,用于将数据从第一数据IO焊盘传送到第二全局数据总线;以及第三数据通路 数据路径,用于根据数据宽度选项将输入到第二数据IO垫的数据传送到第一全局数据总线,其中第二数据路径的数据传送时间基本上等于第三数据路径的数据传送时间。

    Semiconductor memory device
    7.
    发明申请
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US20070002672A1

    公开(公告)日:2007-01-04

    申请号:US11312610

    申请日:2005-12-21

    IPC分类号: G11C8/00

    摘要: Disclosed herein is a semiconductor memory device for reducing a current consumption used for operating a write command or a read command. The semiconductor memory device includes a global data latch unit for latching a global data loaded on a global data line in response to a first write enable signal to thereby generate a global latch data; a local data write driving unit for receiving the global latch data to output a local data to a local data line in response to a second write enable signal; and a write driver control unit for generating the first write enable signal and the second write enable signal to inactivate the first write enable signal when a write operation is not performed.

    摘要翻译: 这里公开了一种用于减少用于操作写入命令或读取命令的电流消耗的半导体存储器件。 半导体存储器件包括全局数据锁​​存单元,用于响应于第一写使能信号来锁存加载在全局数据线上的全局数据,从而生成全局锁存数据; 本地数据写驱动单元,用于接收全局锁存数据,以响应于第二写使能信号将本地数据输出到本地数据线; 以及写入驱动器控制单元,用于在不执行写入操作时产生第一写入使能信号和第二写入使能信号以使第一写入使能信号失活。

    Semiconductor memory device
    8.
    发明申请

    公开(公告)号:US20080151657A1

    公开(公告)日:2008-06-26

    申请号:US12073294

    申请日:2008-03-04

    IPC分类号: G11C7/00

    摘要: Disclosed herein is a semiconductor memory device for reducing a current consumption used for operating a write command or a read command. The semiconductor memory device includes a global data latch unit for latching a global data loaded on a global data line in response to a first write enable signal to thereby generate a global latch data; a local data write driving unit for receiving the global latch data to output a local data to a local data line in response to a second write enable signal; and a write driver control unit for generating the first write enable signal and the second write enable signal to inactivate the first write enable signal when a write operation is not performed.

    Semiconductor memory device
    9.
    发明申请
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US20050276146A1

    公开(公告)日:2005-12-15

    申请号:US11024907

    申请日:2004-12-30

    摘要: A semiconductor memory device resolves skew problem due to delay difference between the case when data that is inputted through data input/output (IO) pin is transferred to one global I/O bus and the case when transferred to another global I/O bus based on data width option. The semiconductor memory device includes a first data IO pad formed at one side of a chip, a second data IO pad formed at the other one, a first global data bus receiving data from the first data IO pad, a second global data bus receiving data from the second data IO pad, a first data path for transferring data from the first data IO pad to the first global data bus, a second data path for transferring data from the first data IO pad to the second global data bus, and a third data path for transferring data inputted to the second data IO pad to the first global data bus depending on data width option, wherein data transfer time of the second data path is substantially equal to data transfer time of the third data path.

    摘要翻译: 半导体存储器件解决由于通过数据输入/输出(IO)引脚输入的数据被传送到一个全局I / O总线的情况之间的延迟差异以及当转移到另一个全局I / O总线时的情况下的偏斜问题 on数据宽度选项。 半导体存储器件包括形成在芯片一侧的第一数据IO焊盘,在另一侧形成的第二数据IO焊盘,第一全局数据总线从第一数据IO焊盘接收数据,第二全局数据总线接收数据 来自第二数据IO垫的第一数据路径,用于将数据从第一数据IO焊盘传送到第一全局数据总线;第二数据通路,用于将数据从第一数据IO焊盘传送到第二全局数据总线;以及第三数据通路 数据路径,用于根据数据宽度选项将输入到第二数据IO垫的数据传送到第一全局数据总线,其中第二数据路径的数据传送时间基本上等于第三数据路径的数据传送时间。

    SEMICONDUCTOR MEMORY INPUT/OUTPUT DEVICE
    10.
    发明申请
    SEMICONDUCTOR MEMORY INPUT/OUTPUT DEVICE 有权
    半导体存储器输入/输出设备

    公开(公告)号:US20090161447A1

    公开(公告)日:2009-06-25

    申请号:US12339389

    申请日:2008-12-19

    IPC分类号: G11C7/10

    摘要: A semiconductor memory input/output device includes selection pads used to input and output signals for multiple operation modes and having multiple functions, a control signal generator for outputting setting signals and a mask control signal, a lower input/output unit including a lower output buffer for outputting a read data strobe signal to a selection pad and a lower input buffer for receiving a lower data mask signal from the selection pad, and selecting one operation of the lower output buffer and the lower input buffer, and an upper input/output unit including an upper output buffer for outputting an inverted read data strobe signal to the second selection pad and an upper input buffer for receiving an upper data mask signal from the second selection pad, and selecting one operation of the upper output buffer and the upper input buffer.

    摘要翻译: 半导体存储器输入/输出装置包括用于输入和输出用于多个操作模式的信号并具有多个功能的选择焊盘,用于输出设置信号的控制信号发生器和掩模控制信号,包括下部输出缓冲器 用于将选择焊盘的读取数据选通信号输出到选择焊盘的下部数据屏蔽信号,以及选择下部输出缓冲器和下部输入缓冲器的一个动作,以及上部输入输出部 包括用于向第二选择焊盘输出反转的读数据选通信号的上输出缓冲器和用于从第二选择焊盘接收上数据掩码信号的上输入缓冲器,以及选择上输出缓冲器和上输入缓冲器的一个操作 。