Heat transferring device having adiabatic unit
    1.
    发明授权
    Heat transferring device having adiabatic unit 失效
    具有绝热单元的传热装置

    公开(公告)号:US06698503B2

    公开(公告)日:2004-03-02

    申请号:US10259877

    申请日:2002-09-30

    IPC分类号: F28D1500

    摘要: A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating element to thus evaporate, a condenser in which gas flowing from the evaporator is condensed, a gas passage through which the gas flowing from the evaporator into condenser, a liquid refrigerant passage through which the liquid refrigerant flows from the condenser into the evaporator and which includes a portion used as a channel region bordering the evaporator, and an adiabatic unit provided between the liquid refrigerant passage and the gas passage so that elements hindering the flow of the liquid refrigerant can be prevented from being introduced from the gas passage into the liquid refrigerant passage; and an upper plate which contacts some members of the lower plate including the adiabatic unit.

    摘要翻译: 提供具有绝热单元的传热装置。 传热装置包括:下部板,包括与加热元件接触的蒸发器,并允许液体制冷剂吸收从加热元件传递的热量从而蒸发;蒸发器中流动的气体被冷凝的冷凝器,气体通道, 从蒸发器流入冷凝器的气体,液体制冷剂通道,液体制冷剂从冷凝器流过蒸发器,并且包括用作与蒸发器相邻的通道区域的部分;以及设置在液体制冷剂通道和 能够防止阻碍液体制冷剂的流入的元件从气体通路导入液体制冷剂通路, 以及接触包括绝热单元的下板的一些构件的上板。

    Capillary pumped loop system
    2.
    发明授权
    Capillary pumped loop system 失效
    毛细管泵回路系统

    公开(公告)号:US06880625B2

    公开(公告)日:2005-04-19

    申请号:US10108549

    申请日:2002-03-29

    IPC分类号: F28D15/02 F28D15/04 F28D15/00

    CPC分类号: F28D15/043

    摘要: A capillary pumped loop system includes an evaporator for vaporizing a refrigerant by absorbing heat from the periphery, a condenser for turning the vaporized refrigerant into a liquid by radiating heat from the vaporized refrigerant, a tube for forming a circulatory path connecting the evaporator to the condenser, and a capillary unit installed to form a plurality of gaps within the tube so that the refrigerant can move along the circulatory path due to capillary action caused by the gaps. Accordingly, when the refrigerant passes through the capillary unit due to the capillary action, bubbles in the tube can be reduced. In addition, a multi-path is formed for the movement of the liquid refrigerant, so discontinuation of the refrigerant can be prevented, thereby preventing the refrigerant in the evaporator from drying out.

    摘要翻译: 毛细管泵回路系统包括:蒸发器,用于通过从外围吸收热量来蒸发制冷剂;冷凝器,用于通过从蒸发的制冷剂中散发热量将蒸发的制冷剂转化为液体;管,用于形成将蒸发器连接到冷凝器的循环路径 以及毛细管单元,其被安装成在管内形成多个间隙,使得制冷剂可以由于由间隙引起的毛细管作用沿着循环路径移动。 因此,当制冷剂由于毛细管作用而通过毛细管单元时,可以减小管中的气泡。 此外,为了液体制冷剂的移动形成多路径,因此可以防止制冷剂的停止,从而防止蒸发器中的制冷剂变干。

    Flat evaporator
    3.
    发明授权

    公开(公告)号:US06609560B2

    公开(公告)日:2003-08-26

    申请号:US10131477

    申请日:2002-04-25

    IPC分类号: F28D1500

    摘要: A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. The evaporator can be implemented as a small and thin cooling device for performing cooling without external power. Furthermore, the evaporator can effectively prevent degradation of fluid flow force due to coexistence of gas and liquid by isolating a liquid coolant from a vaporized coolant by a capillary region, thereby significantly improving heat exchange characteristics.

    Microgyroscope with two resonant plates
    4.
    发明授权
    Microgyroscope with two resonant plates 失效
    具有两个谐振板的微镜

    公开(公告)号:US06467348B1

    公开(公告)日:2002-10-22

    申请号:US09702845

    申请日:2000-11-01

    IPC分类号: G01P904

    CPC分类号: G01C19/574

    摘要: A microgyroscope with two resonant plates is provided. The microgyroscope includes a substrate; first and second frames provided on the substrate to have a predetermined height, the first and second frames facing each other; a plurality of anchors supporting the first and second frames with respect to the substrate; first and second resonant plates provided between the first and second frames to be separated from each other by a predetermined distance; and a matching link unit connected to the first and second resonant plates so that it links the motion of one resonant plate to the motion of the other resonant plate such that the matching link unit is moved by the motion of one resonant plate in a first direction and then moves the other resonant plate in a second direction opposite to the first direction. In the microgyroscope, the difference between the resonance frequencies of the two resonant plates is removed by a self resonant matching structure implemented by the matching link, so that the range of an allowable process error is large, and the microgyroscope can be easily manufactured. Additionally, the reliability and the linearity of a resonance structure are improved. Since the driving beam and the sensing beam are separately designed, mode coupling can be prevented, thereby increasing the sensing sensibility.

    摘要翻译: 提供具有两个谐振板的微型陀螺仪。 微陀螺仪包括基底; 设置在基板上以具有预定高度的第一和第二框架,第一和第二框架彼此面对; 多个锚固件,其相对于所述基板支撑所述第一和第二框架; 设置在第一和第二框架之间的第一和第二谐振板彼此分开预定距离; 以及连接到第一和第二谐振板的匹配连接单元,使得它将一个谐振板的运动连接到另一个谐振板的运动,使得匹配连接单元通过一个谐振板在第一方向上的运动而移动 然后沿与第一方向相反的第二方向移动另一个谐振板。 在微陀螺仪中,通过由匹配链路实现的自谐振匹配结构去除两个谐振板的谐振频率之间的差异,使得允许的工艺误差的范围大,并且可以容易地制造微型陀螺仪。 此外,提高了谐振结构的可靠性和线性度。 由于驱动光束和感测光束是分开设计的,因此可以防止模式耦合,从而增加感测灵敏度。

    Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level
    5.
    发明授权
    Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level 失效
    制造可在晶圆级真空包装的微机电系统结构的方法

    公开(公告)号:US06391673B1

    公开(公告)日:2002-05-21

    申请号:US09702849

    申请日:2000-11-01

    IPC分类号: H01L2100

    摘要: A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.

    摘要翻译: 提供了一种制造可在晶片级真空封装的微机电系统(MEMS)结构的方法。 该方法包括以下步骤:在第一晶片上形成包括信号线的多层堆叠; 将第二晶片接合到所述多层堆叠; 将第一晶片抛光至预定厚度; 在第一晶片的真空区域中形成MEMS结构,在真空区域外形成垫,MEMS结构和焊盘连接到信号线; 在第三晶片中形成具有对应于MEMS结构的真空区域的空间的结构; 以及在真空状态下将所述第三晶片接合到所述第一晶片的抛光表面。 为了保护结构并保持操作所需的真空水平,制造的结构在晶片级被真空包装,从而提高了制造的产量。 此外,由于不需要特殊的真空包装处理,因此可以简化制造。

    Plate type condenser
    6.
    发明授权

    公开(公告)号:US06494058B2

    公开(公告)日:2002-12-17

    申请号:US09682605

    申请日:2001-09-26

    IPC分类号: F25B3904

    摘要: A plate type condenser used in a cooling system is provided. The plate type condenser includes a casing for defining an upper space into which a gaseous refrigerant flows and is cooled, a lower space for accommodating a liquid refrigerant into which the gaseous refrigerant is condensed, and a connecting portion through which the upper and lower spaces communicate with each other. The casing substantially has a plate shape. A refrigerant inlet is installed at an upper portion of the casing to communicate with the upper space. A refrigerant outlet is installed at a lower portion of the casing to communicate with the lower space. A first adiabatic slit for separating the walls of the casing is formed between the upper space and the lower space except at the connecting portion. Accordingly, since the first adiabatic slit prevents heat in the upper space from being conducted to the lower space through the walls of the casing, a liquid refrigerant in the lower space can be satisfactorily cooled without using an additional subcooler.